Electronic packaging.

Overview

Works:	16 works in 3 publications in 3 languages

Titles

Surface mount technology for concurrent engineering and manufacturing / by: (Language materials, printed)

Physical architecture of VLSI systems / by: (Language materials, printed)

Circuits, interconnections, and packaging for VLSI / by: (Language materials, printed)

Thin film technology handbook / by: (Language materials, printed)

The Basics of soldering / by: (Language materials, printed)

Lead-free soldering in electronics : = science, technology and environmental impact / by: (Language materials, printed)

Electrical conductive adhesives with nanotechnologies by: (Language materials, printed)

Packaging of high power semiconductor lasers by: (Electronic resources)

Boundary-scan interconnect diagnosis by: (Language materials, printed)

Subjects

Concurrent engineering.

Integrated circuits- Very large scale integration

Nanostructured materials.

Chemistry.

Biophysics and Biological Physics.

Solid State Physics.

Solder and soldering.

Boundary scan testing.

Bioelectronics.

Nanotechnology.

Biomedical Engineering.

Adhesives- Electric properties.

Semiconductor lasers.

Energy Systems.

Biomedical Engineering and Bioengineering.

Electronics and Microelectronics, Instrumentation.

Integrated circuits- Very large scale integration.

Electronic apparatus and appliances- Testing.

Nanophotonics.

Spectroscopy and Microscopy.

Electric contacts- Testing.

Electrochemistry.

Circuits and Systems.

Materials Science, general.

Power Electronics, Electrical Machines and Networks.

Energy Harvesting.

Electronic packaging.

Power electronics.

Insulation (Heat)

Energy.

Surface mount technology.

Thin film devices- Design and construction.

Thin films.

Engineering.

Optical and Electronic Materials.

Materials.

Physics.

Engineering Thermodynamics, Heat and Mass Transfer.

Electronic Circuits and Devices.