Microelectronic packaging.

Overview

Works:	11 works in 5 publications in 5 languages

Titles

Polymers in microelectronics : = fundamentals and applications / by: (Language materials, printed)

Microvias = for low cost, high density interconnects / by: (Language materials, printed)

RF and Microwave Microelectronics Packaging by: (Language materials, printed)

RF and microwave microelectronics packaging II by: (Electronic resources)

Chiplet design and heterogeneous integration packaging by: (Electronic resources)

Advanced MEMS packaging by: (Electronic resources)

Force Sensors for Microelectronic Packaging Applications by: (Language materials, printed)

Hot Cracking Phenomena in Welds by: (Language materials, printed)

Materials for advanced packaging by: (Language materials, printed)

Bio and nano packaging techniques for electron devices = advances in electronic device packaging / by: (Electronic resources)

Subjects

Polymers.