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書目資訊
主題
Microelectronic packaging.
概要
作品:
11 作品在 5 項出版品 5 種語言
書目資訊
Polymers in microelectronics : = fundamentals and applications /
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(書目-語言資料,印刷品)
Microvias = for low cost, high density interconnects /
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(書目-語言資料,印刷品)
Force Sensors for Microelectronic Packaging Applications
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(書目-語言資料,印刷品)
Hot Cracking Phenomena in Welds
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(書目-語言資料,印刷品)
Materials for advanced packaging
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(書目-語言資料,印刷品)
RF and Microwave Microelectronics Packaging
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(書目-語言資料,印刷品)
Bio and nano packaging techniques for electron devices = advances in electronic device packaging /
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(書目-電子資源)
Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /
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(書目-電子資源)
Chiplet design and heterogeneous integration packaging
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(書目-電子資源)
Advanced MEMS packaging
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(書目-電子資源)
RF and microwave microelectronics packaging II
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(書目-電子資源)
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主題
Chemistry.
Electronics and Microelectronics, Instrumentation
Microwaves, RF and Optical Engineering
Microwaves, RF and Optical Engineering.
Wire bonding (Electronic packaging)
Nanotechnology.
Packaging- Materials.
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Material Science.
Circuits and Systems
Materials Engineering.
Polymers.
Microsystems and MEMS.
Printed circuits.
Continuum Mechanics and Mechanics of Materials.
Materials Science.
Circuits and Systems.
Integrated circuits- Design and construction.
Microelectronics- Materials.
Semiconductors- Junctions.
Metallic Materials.
Microelectronic packaging.
Optical and Electronic Materials.
Physics and Applied Physics in Engineering.
Engineering
Characterization and Evaluation of Materials.
Engineering.
Electronic Circuits and Systems.
Integrated circuits- Design and construction
Quality Control, Reliability, Safety and Risk.
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