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Multichip modules (Microelectronics) - Design and construction.
概要
作品:
5 作品在 1 項出版品 1 種語言
書目資訊
Physical design for multichip modules /
by:
(書目-語言資料,印刷品)
Integrated circuit, hybrid, and multichip module package design guidelines : = a focus on reliability /
by:
(書目-語言資料,印刷品)
Conceptual design of multichip modules and systems /
by:
(書目-語言資料,印刷品)
SiP system-in-package design and simulation = mentor EE flow advanced design guide /
by:
(書目-電子資源)
MicroSystem based on SiP technology
by:
(書目-電子資源)
主題
Electronic packaging- Design.
Semiconductors.
Hybrid integrated circuits- Design and construction.
Multichip modules (Microelectronics)- Design and construction.
Electronics and Microelectronics, Instrumentation.
Integrated circuits- Design and construction.
Industrial and Production Engineering.
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