Chemical mechanical planarization.

Advances in chemical mechanical planarization (CMP) / by: (Electronic resources)

Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect by: (Electronic resources)

Manufacturing, Machines, Tools.

Chemical mechanical planarization.

Tribology, Corrosion and Coatings.

Microelectronics.

Ruthenium.

Electronics and Microelectronics, Instrumentation.

Nanoelectronics.

Engineering.