Engineering, Packaging.

Automated design process of sustainable industrial packaging. by: (書目-語言資料,印刷品)

High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties. by: (書目-語言資料,印刷品)

Utilization of chlorine dioxide gas in food packaging application . by: (書目-語言資料,印刷品)

Titanate and silane coupling agents based surface modifications of clay and their effects on the performance of poly(trimethylene terephthalate) nanocomposites. by: (書目-語言資料,印刷品)

The shelf life and in package cooking of ready-to-eat fresh asparagus in microwaveable MAP and VSP tray systems. by: (書目-語言資料,印刷品)

The effect of surface treatments and modified atmosphere packaging (MAP) on the quality of fresh cut sliced Anjou pears. by: (書目-語言資料,印刷品)

Comparative performance of PLA and PET bottles for alcohol and sugar acid solution. by: (書目-語言資料,印刷品)

Theoretical studies of nonisothermal multilayer coextrusion flow---a new approach. by: (書目-電子資源)

Polymer-polymer adhesion in melt-processed multilayered structures. by: (書目-電子資源)

Low temperature metal-based micro fabrication and packaging technology. by: (書目-電子資源)

Microtensile testing and cyclic deformation of freestanding aluminum thin films. by: (書目-電子資源)

Analysis of package labeling: An evaluative tool to compare cost structures and implementation of postponement strategies. by: (書目-電子資源)

Development and characterization of gelatin films as active packaging layers. by: (書目-電子資源)

An expert system application to the inspection analysis of paper printing quality in a package printing company. by: (書目-電子資源)

Corrugated cushion vs. EPS: A comparison of cushion properties. by: (書目-電子資源)

The effect of antennae configuration, product and tag type on readability of passive UHF RFID transponders. by: (書目-電子資源)

Finite-difference full-vectorial beam propagation method development and microlens design for fiber to laser diode coupling. by: (書目-電子資源)

Design and characterization of electroceramic interfaces for packaging and microwave frequency applications. by: (書目-電子資源)

Reliability quantification of printed circuit boards subjected to thermal and vibration loads. by: (書目-電子資源)

Fountain solution pH and conductivity changes caused by paper extractables during offset printing. by: (書目-電子資源)

Radio frequency identification transponder performance on refrigerated and frozen beef loin muscle packages. by: (書目-電子資源)

The effect of tag orientation and package content on the readability of radio frequency identification (RFID) transponders. by: (書目-電子資源)

Refurbished electronics assembly equipment: Case studies for R&D and manufacturing. by: (書目-電子資源)

Thin film technologies for hermetic and vacuum packaging of MEMS. by: (書目-電子資源)

Quality inspection for cheese packaging using machine vision and image processing. by: (書目-語言資料,印刷品)

Expanded polystyrene foam design with emphasis on nonimpact cushioning applications. by: (書目-語言資料,印刷品)

Characterization and reliability analysis of wire bonds inside a package subjected to cyclic loading. by: (書目-電子資源)

Finite element analysis of moisture and thermal induced stress in flip chip packages. by: (書目-電子資源)

MEMS packaging: Fluxless soldering and reliability assessment. by: (書目-電子資源)

Electrical interconnect of components transferred by fluidic microassembly using capillary forces. by: (書目-電子資源)

Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring. by: (書目-電子資源)

Modeling and characterization for small-scale packaging applications. by: (書目-電子資源)

Measuring arousal through physiological responses to packaging designs: Investigating the validity of electrodermal activity as a measure of arousal in a realistic shopping environment. by: (書目-語言資料,印刷品)

A decision support system utilizing AHP for solder defect solutions in electronics packaging. by: (書目-語言資料,印刷品)

A multi-scale damage mechanics framework for nanoelectronics interconnects and solder joints. by: (書目-電子資源)

Multidisciplinary design and optimization in electronics and MEMS packaging. by: (書目-電子資源)

A front-end wafer-level microsystem packaging technique with micro-cap array. by: (書目-語言資料,印刷品)

Heat transfer properties of home meal replacement product/package systems. by: (書目-語言資料,印刷品)

Antimicrobial activity of chitosan impregnated into packaging films and chitosan in solution. by: (書目-語言資料,印刷品)

Effect of ozone and chlorine dioxide treatments used in perishable food applications on polymeric materials: Changes in mechanical, thermal and mass transfer properties. by: (書目-語言資料,印刷品)

Packaging requirements for pulsed electric field processed orange juice. by: (書目-語言資料,印刷品)

Development of a computer model to evaluate the ability of plastics to act as functional barriers. by: (書目-語言資料,印刷品)

Prognostics demonstration of electronic components subjected to vibration environment of a light military tactical vehicle. by: (書目-語言資料,印刷品)

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation. by: (書目-語言資料,印刷品)

A novel solid state general illumination source. by: (書目-語言資料,印刷品)

Design and characterization of microfabricated three-dimensional millimeter-wave components. by: (書目-語言資料,印刷品)

A rules-based expert system for determining inventory location in a distribution warehouse. by: (書目-電子資源)

Temperature retention effectiveness of three packaging materials for selected hot food products. by: (書目-電子資源)

The effects of electron beam-cured coatings on polymer substrates. by: (書目-電子資源)

Basic and applied studies of electrically conductive adhesives. by: (書目-電子資源)

Adhesion and subcritical debonding of polymer/inorganic interfaces in the absence of threshold. by: (書目-電子資源)

Solid and fluid mechanics case studies in advanced electronic packaging. by: (書目-電子資源)

Design for the environment in electronics manufacturing: Product optimization for waste stream minimization. by: (書目-電子資源)

Nodal topology in compact thermal models. by: (書目-電子資源)

Use of silver zeolite as an antimicrobial agent in packaging film. by: (書目-電子資源)

Constitutive modeling of woven-fabric composites for concurrent design. by: (書目-電子資源)

Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing. by: (書目-電子資源)

A model for the implementation of a radio frequency identification system into a warehouse environment. by: (書目-電子資源)

A new simulation method providing shock mount selection assurance. by: (書目-電子資源)

Stewardship of plastic packaging in Manitoba: A multi-stakeholder model. by: (書目-電子資源)

Analytical concepting for integrated material handling systems. by: (書目-電子資源)

Selection and use of silane adhesion promoters in microelectronic packaging. by: (書目-電子資源)

Solid state diffusion kinetics of intermetallic compound formation in composite solders. by: (書目-電子資源)

Fundamentals of solder interconnect wetting. by: (書目-電子資源)

Flip chip assembly in air from manufacturing and reliability perspectives. by: (書目-電子資源)

An adaptive tabu search approach to cutting and packing problems. by: (書目-電子資源)

LCA comparison of 100 % bio-based PET synthesized from different PTA pathways. by: (書目-語言資料,印刷品)

Packaging Process and Materials Optimization for Enhancing Performance of White LED Emitters. by: (書目-語言資料,印刷品)