Engineering, Packaging.
Overview
| Works: | 78 works in 0 publications in 0 languages | |
|---|---|---|
Titles
Mathematical models to predict the performance of insulating packages and their practical uses.
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Study of tin-silver-copper alloy reliability through material microstructure evolution and laser moire interferometry.
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A front-end wafer-level microsystem packaging technique with micro-cap array.
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Heat transfer properties of home meal replacement product/package systems.
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Packaging requirements for pulsed electric field processed orange juice.
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The effects of including/excluding attributes on consumer choice: An empirical study of new food packaging.
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Expanded polystyrene foam design with emphasis on nonimpact cushioning applications.
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Design and characterization of microfabricated three-dimensional millimeter-wave components.
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Utilization of chlorine dioxide gas in food packaging application .
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Titanate and silane coupling agents based surface modifications of clay and their effects on the performance of poly(trimethylene terephthalate) nanocomposites.
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The shelf life and in package cooking of ready-to-eat fresh asparagus in microwaveable MAP and VSP tray systems.
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Theoretical studies of nonisothermal multilayer coextrusion flow---a new approach.
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(Electronic resources)
The effect of antennae configuration, product and tag type on readability of passive UHF RFID transponders.
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Design and characterization of electroceramic interfaces for packaging and microwave frequency applications.
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(Electronic resources)
Adhesion and subcritical debonding of polymer/inorganic interfaces in the absence of threshold.
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Low temperature wafer scale MEMS packaging and intrapackage humidity monitoring.
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(Electronic resources)
LCA comparison of 100 % bio-based PET synthesized from different PTA pathways.
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Quality inspection for cheese packaging using machine vision and image processing.
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A multi-scale damage mechanics framework for nanoelectronics interconnects and solder joints.
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(Electronic resources)
Multidisciplinary design and optimization in electronics and MEMS packaging.
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Antimicrobial activity of chitosan impregnated into packaging films and chitosan in solution.
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Effect of ozone and chlorine dioxide treatments used in perishable food applications on polymeric materials: Changes in mechanical, thermal and mass transfer properties.
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Development of a computer model to evaluate the ability of plastics to act as functional barriers.
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High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties.
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The effect of surface treatments and modified atmosphere packaging (MAP) on the quality of fresh cut sliced Anjou pears.
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Comparative performance of PLA and PET bottles for alcohol and sugar acid solution.
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Microtensile testing and cyclic deformation of freestanding aluminum thin films.
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(Electronic resources)
Analysis of package labeling: An evaluative tool to compare cost structures and implementation of postponement strategies.
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Development and characterization of gelatin films as active packaging layers.
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An expert system application to the inspection analysis of paper printing quality in a package printing company.
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Packaging Process and Materials Optimization for Enhancing Performance of White LED Emitters.
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Measuring arousal through physiological responses to packaging designs: Investigating the validity of electrodermal activity as a measure of arousal in a realistic shopping environment.
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Prognostics demonstration of electronic components subjected to vibration environment of a light military tactical vehicle.
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Finite-difference full-vectorial beam propagation method development and microlens design for fiber to laser diode coupling.
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(Electronic resources)
Reliability quantification of printed circuit boards subjected to thermal and vibration loads.
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Characterization and reliability analysis of wire bonds inside a package subjected to cyclic loading.
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(Electronic resources)
Finite element analysis of moisture and thermal induced stress in flip chip packages.
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A model for the implementation of a radio frequency identification system into a warehouse environment.
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(Electronic resources)
A decision support system utilizing AHP for solder defect solutions in electronics packaging.
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Correlation of analyses of odor profiles of HDPE films coated with different adhesives using electronic nose, sensory evaluation, and GC-MS.
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Comparison of different packaging materials to determine their effect on availability and effectiveness of 1-methylcyclopropene.
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The effect of packaging attributes on consumer perception of cherry juice.
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Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
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A rules-based expert system for determining inventory location in a distribution warehouse.
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(Electronic resources)
Temperature retention effectiveness of three packaging materials for selected hot food products.
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Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
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Safety studies with proteolytic Clostridium botulinum in high-moisture bakery products packaged under modified atmospheres.
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Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.
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Fountain solution pH and conductivity changes caused by paper extractables during offset printing.
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(Electronic resources)
Radio frequency identification transponder performance on refrigerated and frozen beef loin muscle packages.
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(Electronic resources)
The effect of tag orientation and package content on the readability of radio frequency identification (RFID) transponders.
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(Electronic resources)
Refurbished electronics assembly equipment: Case studies for R&D and manufacturing.
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Electrical interconnect of components transferred by fluidic microassembly using capillary forces.
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Selection and use of silane adhesion promoters in microelectronic packaging.
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Solid state diffusion kinetics of intermetallic compound formation in composite solders.
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Flip chip assembly in air from manufacturing and reliability perspectives.
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