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3D stacked chips = from emerging pro...

Elfadel, Ibrahim M.

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3D stacked chips = from emerging processes to heterogeneous systems /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	3D stacked chips/ edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis.
其他題名:	from emerging processes to heterogeneous systems /
其他作者:	Elfadel, Ibrahim M.
出版者:	Cham :Springer International Publishing : : 2016.,
面頁冊數:	xxiii, 339 p. :ill. (some col.), digital ;24 cm.
內容註:	Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.
Contained By:	Springer eBooks
標題:	Three-dimensional integrated circuits. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-20481-9
ISBN:	9783319204819

3D stacked chips = from emerging processes to heterogeneous systems /
3D stacked chipsfrom emerging processes to heterogeneous systems /[electronic resource] :edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis. - Cham :Springer International Publishing :2016. - xxiii, 339 p. :ill. (some col.), digital ;24 cm.

Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.

ISBN: 9783319204819

Standard No.: 10.1007/978-3-319-20481-9doiSubjects--Topical Terms:

2142302
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.395

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