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More-than-Moore 2.5D and 3D SiP inte...

Radojcic, Riko.

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More-than-Moore 2.5D and 3D SiP integration

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	More-than-Moore 2.5D and 3D SiP integration/ by Riko Radojcic.
作者:	Radojcic, Riko.
出版者:	Cham :Springer International Publishing : : 2017.,
面頁冊數:	xv, 182 p. :ill., digital ;24 cm.
內容註:	Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.
Contained By:	Springer eBooks
標題:	Embedded computer systems. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-52548-8
ISBN:	9783319525488

More-than-Moore 2.5D and 3D SiP integration
Radojcic, Riko.

More-than-Moore 2.5D and 3D SiP integration[electronic resource] /by Riko Radojcic. - Cham :Springer International Publishing :2017. - xv, 182 p. :ill., digital ;24 cm.

Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

ISBN: 9783319525488

Standard No.: 10.1007/978-3-319-52548-8doiSubjects--Topical Terms:

582088
Embedded computer systems.

LC Class. No.: TK7895.E42

Dewey Class. No.: 006.22

More-than-Moore 2.5D and 3D SiP integration
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