東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁 到查詢結果 [ subject:"Silicon-on-insulator technology." ]

切換: 標籤 | MARC模式 | ISBD

Silicon semiconductor technology = p...

Hilleringmann, Ulrich.

FindBook

Google Book

Amazon

博客來

Silicon semiconductor technology = processing and integration of microelectronic devices /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Silicon semiconductor technology/ by Ulrich Hilleringmann.
其他題名:	processing and integration of microelectronic devices /
作者:	Hilleringmann, Ulrich.
出版者:	Wiesbaden :Springer Fachmedien Wiesbaden : : 2023.,
面頁冊數:	xi, 264 p. :ill., digital ;24 cm.
內容註:	Wafer fabrication -- Thermal oxidation -- Lithography -- Etching technology -- Doping techniques -- Chemical and Physical Deposition -- Metallization and Contacts.
Contained By:	Springer Nature eBook
標題:	Semiconductors. -
電子資源:	https://doi.org/10.1007/978-3-658-41041-4
ISBN:	9783658410414

Silicon semiconductor technology = processing and integration of microelectronic devices /
Hilleringmann, Ulrich.

Silicon semiconductor technologyprocessing and integration of microelectronic devices /[electronic resource] :by Ulrich Hilleringmann. - Wiesbaden :Springer Fachmedien Wiesbaden :2023. - xi, 264 p. :ill., digital ;24 cm.

Wafer fabrication -- Thermal oxidation -- Lithography -- Etching technology -- Doping techniques -- Chemical and Physical Deposition -- Metallization and Contacts.

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. The Content Wafer fabrication Thermal oxidation Lithography Etching technology Doping techniques Chemical and Physical Deposition Metallization and Contacts About the Author Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.

ISBN: 9783658410414

Standard No.: 10.1007/978-3-658-41041-4doiSubjects--Topical Terms:

516162
Semiconductors.

LC Class. No.: TK7871.85

Dewey Class. No.: 621.38152

Silicon semiconductor technology = processing and integration of microelectronic devices /
LDR:02195nmm a2200325 a 4500 001 2333074
003 DE-He213
005 20230802084555.0
006 m d
007 cr nn 008maaau
008 240402s2023 gw s 0 eng d
020 $a 9783658410414 $q (electronic bk.)
020 $a 9783658410407 $q (paper)
024 7 $a 10.1007/978-3-658-41041-4 $2 doi
035 $a 978-3-658-41041-4
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7871.85
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.38152 $2 23
090 $a TK7871.85 $b .H652 2023
100 1 $a Hilleringmann, Ulrich. $3 3299784
245 1 0 $a Silicon semiconductor technology $h [electronic resource] : $b processing and integration of microelectronic devices / $c by Ulrich Hilleringmann.
260 $a Wiesbaden : $b Springer Fachmedien Wiesbaden : $b Imprint: Springer Vieweg, $c 2023.
300 $a xi, 264 p. : $b ill., digital ; $c 24 cm.
505 0 $a Wafer fabrication -- Thermal oxidation -- Lithography -- Etching technology -- Doping techniques -- Chemical and Physical Deposition -- Metallization and Contacts.
520 $a The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. The Content Wafer fabrication Thermal oxidation Lithography Etching technology Doping techniques Chemical and Physical Deposition Metallization and Contacts About the Author Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.
650 0 $a Semiconductors. $3 516162
650 0 $a Semiconductors $x Materials. $3 553292
650 0 $a Silicon-on-insulator technology. $3 739182
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Electronic Circuits and Systems. $3 3538814
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-3-658-41041-4
950 $a Engineering (SpringerNature-11647)