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Advanced packaging and manufacturing...

Seok, Seonho.

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Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced packaging and manufacturing technology based on adhesion engineering/ by Seonho Seok.
Reminder of title:	wafer-level transfer packaging and fabrication techniques using interface energy control method /
Author:	Seok, Seonho.
Published:	Cham :Springer International Publishing : : 2018.,
Description:	viii, 115 p. :ill., digital ;24 cm.
[NT 15003449]:	Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.
Contained By:	Springer eBooks
Subject:	Engineering. -
Online resource:	http://dx.doi.org/10.1007/978-3-319-77872-3
ISBN:	9783319778723

Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /
Seok, Seonho.

Advanced packaging and manufacturing technology based on adhesion engineeringwafer-level transfer packaging and fabrication techniques using interface energy control method /[electronic resource] :by Seonho Seok. - Cham :Springer International Publishing :2018. - viii, 115 p. :ill., digital ;24 cm. - Springer series in advanced manufacturing,1860-5168. - Springer series in advanced manufacturing..

Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

ISBN: 9783319778723

Standard No.: 10.1007/978-3-319-77872-3doiSubjects--Topical Terms:

586835
Engineering.

LC Class. No.: TJ241 / .S465 2018

Dewey Class. No.: 621.381046

Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /
LDR:02764nmm a2200325 a 4500 001 2142169
003 DE-He213
005 20181112155614.0
006 m d
007 cr nn 008maaau
008 181214s2018 gw s 0 eng d
020 $a 9783319778723 $q (electronic bk.)
020 $a 9783319778716 $q (paper)
024 7 $a 10.1007/978-3-319-77872-3 $2 doi
035 $a 978-3-319-77872-3
040 $a GP $c GP
041 0 $a eng
050 4 $a TJ241 $b .S465 2018
072 7 $a TGXT $2 bicssc
072 7 $a TEC020000 $2 bisacsh
082 0 4 $a 621.381046 $2 23
090 $a TJ241 $b .S478 2018
100 1 $a Seok, Seonho. $3 3321562
245 1 0 $a Advanced packaging and manufacturing technology based on adhesion engineering $h [electronic resource] : $b wafer-level transfer packaging and fabrication techniques using interface energy control method / $c by Seonho Seok.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2018.
300 $a viii, 115 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer series in advanced manufacturing, $x 1860-5168
505 0 $a Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.
520 $a This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
650 0 $a Engineering. $3 586835
650 0 $a Nanotechnology. $3 526235
650 0 $a Manufacturing industries. $3 880198
650 0 $a Machinery. $3 524780
650 0 $a Tools. $3 563442
650 0 $a Tribology. $3 626393
650 0 $a Corrosion and anti-corrosives. $3 650235
650 0 $a Coatings. $3 558166
650 0 $a Materials science. $3 543314
650 2 4 $a Manufacturing, Machines, Tools. $3 891025
650 2 4 $a Nanotechnology and Microengineering. $3 1005737
650 2 4 $a Characterization and Evaluation of Materials. $3 890988
650 2 4 $a Tribology, Corrosion and Coatings. $3 894259
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a Springer series in advanced manufacturing. $3 1566004
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-77872-3
950 $a Engineering (Springer-11647)