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Modeling and application of flexible...

Huang, YongAn.

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Modeling and application of flexible electronics packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Modeling and application of flexible electronics packaging/ by YongAn Huang, Zhouping Yin, Xiaodong Wan.
作者:	Huang, YongAn.
其他作者:	Yin, Zhouping.
出版者:	Singapore :Springer Singapore : : 2019.,
面頁冊數:	xvii, 287 p. :ill., digital ;24 cm.
內容註:	Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
Contained By:	Springer eBooks
標題:	Flexible electronics. -
電子資源:	https://doi.org/10.1007/978-981-13-3627-0
ISBN:	9789811336270

Modeling and application of flexible electronics packaging
Huang, YongAn.

Modeling and application of flexible electronics packaging[electronic resource] /by YongAn Huang, Zhouping Yin, Xiaodong Wan. - Singapore :Springer Singapore :2019. - xvii, 287 p. :ill., digital ;24 cm.

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

ISBN: 9789811336270

Standard No.: 10.1007/978-981-13-3627-0doiSubjects--Topical Terms:

3315410
Flexible electronics.

LC Class. No.: TK7872.F54 / H836 2019

Dewey Class. No.: 621.381

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505 0 $a Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
520 $a This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
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