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Thermal integrity in mechanics and e...

Shorr, Boris F.

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Thermal integrity in mechanics and engineering

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Thermal integrity in mechanics and engineering/ by Boris F. Shorr.
作者:	Shorr, Boris F.
出版者:	Berlin, Heidelberg :Springer Berlin Heidelberg : : 2015.,
面頁冊數:	xviii, 410 p. :ill., digital ;24 cm.
內容註:	Introduction -- Thermoelasticity -- Thermal plasticity. Unidirectional proportional loading -- Thermal plasticity. Cyclic loading and heating -- Unsteady thermal plasticity -- Creep and long-term strength at stationary stresses and temperatures -- Cyclic creep. Thermocyclic durability -- Creep and durability at non-stationary loading and heating -- Estimation of design thermal integrity -- Elastic and inelastic thermal stability -- Thermal integrity of anisotropic bodies -- Special problems of thermal integrity.
Contained By:	Springer eBooks
標題:	Materials - Thermal properties. -
電子資源:	http://dx.doi.org/10.1007/978-3-662-46968-2
ISBN:	9783662469682 (electronic bk.)

Thermal integrity in mechanics and engineering
Shorr, Boris F.

Thermal integrity in mechanics and engineering[electronic resource] /by Boris F. Shorr. - Berlin, Heidelberg :Springer Berlin Heidelberg :2015. - xviii, 410 p. :ill., digital ;24 cm. - Foundations of engineering mechanics,1612-1384. - Foundations of engineering mechanics..

Introduction -- Thermoelasticity -- Thermal plasticity. Unidirectional proportional loading -- Thermal plasticity. Cyclic loading and heating -- Unsteady thermal plasticity -- Creep and long-term strength at stationary stresses and temperatures -- Cyclic creep. Thermocyclic durability -- Creep and durability at non-stationary loading and heating -- Estimation of design thermal integrity -- Elastic and inelastic thermal stability -- Thermal integrity of anisotropic bodies -- Special problems of thermal integrity.

The book is targeted at engineers, university lecturers, postgraduates, and final year undergraduate students involved in computational modelling and experimental and theoretical analysis of the high-temperature behavior of engineering structures. It will also be of interest to researchers developing the thermal strength theory as a branch of continuum mechanics. Thermal integrity is a multidisciplinary field combining the expertise of mechanical engineers, material scientists and applied mathematicians, each approaching the problem from their specific viewpoint. This monograph draws on the research of a broad scientific community including the author's contribution. The scope of thermal strength analysis was considerably extended thanks to modern computers and the implementation of FEM codes. However, the author believes that some material models adopted in the advanced high-performance software, are not sufficiently justificated due to lack of easy-to-follow books on the theoretical and experimental aspects of thermal integrity. The author endeavors to provide a thorough yet sufficiently simple presentation of the underlying concepts, making the book compelling to a wide audience.

ISBN: 9783662469682 (electronic bk.)

Standard No.: 10.1007/978-3-662-46968-2doiSubjects--Topical Terms:

535415
Materials
--Thermal properties.

LC Class. No.: TA418.24

Dewey Class. No.: 620.11

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520 $a The book is targeted at engineers, university lecturers, postgraduates, and final year undergraduate students involved in computational modelling and experimental and theoretical analysis of the high-temperature behavior of engineering structures. It will also be of interest to researchers developing the thermal strength theory as a branch of continuum mechanics. Thermal integrity is a multidisciplinary field combining the expertise of mechanical engineers, material scientists and applied mathematicians, each approaching the problem from their specific viewpoint. This monograph draws on the research of a broad scientific community including the author's contribution. The scope of thermal strength analysis was considerably extended thanks to modern computers and the implementation of FEM codes. However, the author believes that some material models adopted in the advanced high-performance software, are not sufficiently justificated due to lack of easy-to-follow books on the theoretical and experimental aspects of thermal integrity. The author endeavors to provide a thorough yet sufficiently simple presentation of the underlying concepts, making the book compelling to a wide audience.
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