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Investigation of grinding wheel loading.
~
Zhang, Ping.
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Investigation of grinding wheel loading.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Investigation of grinding wheel loading./
作者:
Zhang, Ping.
面頁冊數:
213 p.
附註:
Source: Dissertation Abstracts International, Volume: 66-12, Section: B, page: 6895.
Contained By:
Dissertation Abstracts International66-12B.
標題:
Engineering, Mechanical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3198034
ISBN:
9780542438714
Investigation of grinding wheel loading.
Zhang, Ping.
Investigation of grinding wheel loading.
- 213 p.
Source: Dissertation Abstracts International, Volume: 66-12, Section: B, page: 6895.
Thesis (Ph.D.)--Michigan Technological University, 2006.
Grinding is an effective machining process in the manufacture of hard materials due to its multiple abrasive cutting particles. The condition of the grinding wheel constantly changes as grits wear and chips accumulate in the spaces between grits. The overall performance of the grinding operation is directly affected by the amount of wheel loading. Chip accumulation (or loading) is particularly problematic with fine grit wheels. An improved understanding of the loading mechanism would benefit the whole grinding operation.
ISBN: 9780542438714Subjects--Topical Terms:
783786
Engineering, Mechanical.
Investigation of grinding wheel loading.
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Source: Dissertation Abstracts International, Volume: 66-12, Section: B, page: 6895.
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Adviser: Michele H. Miller.
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Thesis (Ph.D.)--Michigan Technological University, 2006.
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Grinding is an effective machining process in the manufacture of hard materials due to its multiple abrasive cutting particles. The condition of the grinding wheel constantly changes as grits wear and chips accumulate in the spaces between grits. The overall performance of the grinding operation is directly affected by the amount of wheel loading. Chip accumulation (or loading) is particularly problematic with fine grit wheels. An improved understanding of the loading mechanism would benefit the whole grinding operation.
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In this work, a model including three stages for the wheel loading cycle is developed: chip initiation, chip accumulation and chip ejection from the wheel surface. The first two stages are associated with multiple adhesion mechanisms. Based on simulation and experiment, physical adsorption can be considered a significant factor for wheel loading during chip initiation and accumulation. EDS and x-ray diffraction analysis identify diffusion as another factor that causes grinding wheel loading during initiation and accumulation. SEM observations show that mechanical interlocking is a significant factor during initiation. Chip ejection is a process of wheel wear or self-dressing, during which grinding chips are removed from the wheel surface.
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By experimentally investigating the effects of grinding conditions, wheel characteristics and workpiece hardness, some guidelines are established for reducing loading in industrial applications. As an alternative to traditional dressing techniques, vibration assisted grinding is presented as an effective way to reduce wheel loading. Experiments show that wheel loading decreases with increased vibration frequency and amplitude. Temperature reduction in vibration assisted grinding is considered the primary reason for loading reduction in this process.
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http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3198034
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