語系:
繁體中文
English
說明(常見問題)
回圖書館首頁
手機版館藏查詢
登入
回首頁
到查詢結果
[ subject:"Chemical mechanical planarization." ]
切換:
標籤
|
MARC模式
|
ISBD
Research on chemical mechanical poli...
~
Cheng, Jie.
FindBook
Google Book
Amazon
博客來
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect/ by Jie Cheng.
作者:
Cheng, Jie.
出版者:
Singapore :Springer Singapore : : 2018.,
面頁冊數:
xviii, 137 p. :ill., digital ;24 cm.
Contained By:
Springer eBooks
標題:
Chemical mechanical planarization. -
電子資源:
http://dx.doi.org/10.1007/978-981-10-6165-3
ISBN:
9789811061653
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
Cheng, Jie.
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
[electronic resource] /by Jie Cheng. - Singapore :Springer Singapore :2018. - xviii, 137 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
ISBN: 9789811061653
Standard No.: 10.1007/978-981-10-6165-3doiSubjects--Topical Terms:
3235220
Chemical mechanical planarization.
LC Class. No.: TK7874.84
Dewey Class. No.: 621.38152
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
LDR
:01757nmm a2200313 a 4500
001
2131268
003
DE-He213
005
20180601133507.0
006
m d
007
cr nn 008maaau
008
181005s2018 si s 0 eng d
020
$a
9789811061653
$q
(electronic bk.)
020
$a
9789811061646
$q
(paper)
024
7
$a
10.1007/978-981-10-6165-3
$2
doi
035
$a
978-981-10-6165-3
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
TK7874.84
072
7
$a
TGXT
$2
bicssc
072
7
$a
TEC020000
$2
bisacsh
082
0 4
$a
621.38152
$2
23
090
$a
TK7874.84
$b
.C518 2018
100
1
$a
Cheng, Jie.
$3
3296645
245
1 0
$a
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
$h
[electronic resource] /
$c
by Jie Cheng.
260
$a
Singapore :
$b
Springer Singapore :
$b
Imprint: Springer,
$c
2018.
300
$a
xviii, 137 p. :
$b
ill., digital ;
$c
24 cm.
490
1
$a
Springer theses,
$x
2190-5053
520
$a
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
650
0
$a
Chemical mechanical planarization.
$3
3235220
650
0
$a
Ruthenium.
$3
812217
650
1 4
$a
Engineering.
$3
586835
650
2 4
$a
Manufacturing, Machines, Tools.
$3
891025
650
2 4
$a
Tribology, Corrosion and Coatings.
$3
894259
650
2 4
$a
Electronics and Microelectronics, Instrumentation.
$3
893838
710
2
$a
SpringerLink (Online service)
$3
836513
773
0
$t
Springer eBooks
830
0
$a
Springer theses.
$3
1314442
856
4 0
$u
http://dx.doi.org/10.1007/978-981-10-6165-3
950
$a
Engineering (Springer-11647)
筆 0 讀者評論
館藏地:
全部
電子資源
出版年:
卷號:
館藏
1 筆 • 頁數 1 •
1
條碼號
典藏地名稱
館藏流通類別
資料類型
索書號
使用類型
借閱狀態
預約狀態
備註欄
附件
W9340003
電子資源
11.線上閱覽_V
電子書
EB TK7874.84
一般使用(Normal)
在架
0
1 筆 • 頁數 1 •
1
多媒體
評論
新增評論
分享你的心得
Export
取書館
處理中
...
變更密碼
登入