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Development of parylene/PDMS bi-laye...

Lee, Hyungsuk.

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Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Development of parylene/PDMS bi-layer coating and characterization using nanoindentation./
Author:	Lee, Hyungsuk.
Description:	98 p.
Notes:	Adviser: Junghyun Cho.
Contained By:	Masters Abstracts International44-06.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1435195
ISBN:	9780542716287

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
Lee, Hyungsuk.

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation. - 98 p.

Adviser: Junghyun Cho.

Thesis (M.S.)--State University of New York at Binghamton, 2006.

Recent microelectronic devices and microelectromechanical systems (MEMS) introduce a number of packaging issues that are distinct and different from conventional electronic packaging as devices are becoming problematic. In addition, the packaging or encapsulation materials are often exposed to harsh environments where their performance can be drastically degraded. The use of polymers has been increasing in packaging applications, including substrates, adhesives, encapsulants, and overmolds of the components. Often the surface of these polymers needs to be effectively protected as they are not mechanically robust and may not possess sufficient hermetic protection.

ISBN: 9780542716287Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
LDR:01869nam 2200289 a 45 001 964335
005 20110901
008 110901s2006 eng d
020 $a 9780542716287
035 $a (UMI)AAI1435195
035 $a AAI1435195
040 $a UMI $c UMI
100 1 $a Lee, Hyungsuk. $3 1287395
245 1 0 $a Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
300 $a 98 p.
500 $a Adviser: Junghyun Cho.
500 $a Source: Masters Abstracts International, Volume: 44-06, page: 2958.
502 $a Thesis (M.S.)--State University of New York at Binghamton, 2006.
520 $a Recent microelectronic devices and microelectromechanical systems (MEMS) introduce a number of packaging issues that are distinct and different from conventional electronic packaging as devices are becoming problematic. In addition, the packaging or encapsulation materials are often exposed to harsh environments where their performance can be drastically degraded. The use of polymers has been increasing in packaging applications, including substrates, adhesives, encapsulants, and overmolds of the components. Often the surface of these polymers needs to be effectively protected as they are not mechanically robust and may not possess sufficient hermetic protection.
520 $a The use of surface coatings on the polymer packages broadens their applications by providing a cost-effective solution for the protection of critical components. Elastomeric polydimethylsiloxane (PDMS) is a good candidate material for surface coatings or encapsulations. (Abstract shortened by UMI.)
590 $a School code: 0792.
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0549
690 $a 0794
710 2 0 $a State University of New York at Binghamton. $3 737493
773 0 $t Masters Abstracts International $g 44-06.
790 $a 0792
790 1 0 $a Cho, Junghyun, $e advisor
791 $a M.S.
792 $a 2006
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1435195