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A front-end wafer-level microsystem ...

Chiang, Yuh-Min.

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A front-end wafer-level microsystem packaging technique with micro-cap array.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	A front-end wafer-level microsystem packaging technique with micro-cap array./
Author:	Chiang, Yuh-Min.
Description:	177 p.
Notes:	Chair: Guann-Pyng Li.
Contained By:	Dissertation Abstracts International63-01B.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3039195
ISBN:	0493524274

A front-end wafer-level microsystem packaging technique with micro-cap array.
Chiang, Yuh-Min.

A front-end wafer-level microsystem packaging technique with micro-cap array. - 177 p.

Chair: Guann-Pyng Li.

Thesis (Ph.D.)--University of California, Irvine, 2002.

The back-end packaging process is the remaining challenge for the micromachining industry to commercialize microsystem technology (MST) devices at low cost. This dissertation presents a novel wafer level protection technique as a final step of the front-end fabrication process for MSTs. It facilitates improved manufacturing throughput and automation in package assembly, wafer level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized micro-cap array, which consists of an assortment of small caps micro-molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments during packaging. The micro-cap array is first constructed by a micromachining process with micro-molding technique, then sealed to the device wafer at wafer level. Epoxy-based wafer-level micro cap array has been successfully fabricated and showed good compatibility with conventional back-end packaging processes. An adhesive transfer technique was demonstrated to seal the micro cap array with a MEMS device wafer. No damage or gross leak was observed while wafer dicing or later during a gross leak test. Applications of the micro cap array are demonstrated on MEMS, microactuators fabricated using CRONOS MUMPS process. Depending on the application needs, the micro-molded cap can be designed and modified to facilitate additional component functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. Successful fabrication of a micro cap array comprised with microlenses can provide active functions as well as passive protection. An optical tweezer array could be one possibility for applications of a micro cap with microlenses. The micro cap itself could serve as micro well for DNA or bacteria amplification as well.

ISBN: 0493524274Subjects--Topical Terms:

1017759
Engineering, Materials Science.

A front-end wafer-level microsystem packaging technique with micro-cap array.
LDR:02766nam 2200277 a 45 001 929570
005 20110427
008 110427s2002 eng d
020 $a 0493524274
035 $a (UnM)AAI3039195
035 $a AAI3039195
040 $a UnM $c UnM
100 1 $a Chiang, Yuh-Min. $3 1253059
245 1 0 $a A front-end wafer-level microsystem packaging technique with micro-cap array.
300 $a 177 p.
500 $a Chair: Guann-Pyng Li.
500 $a Source: Dissertation Abstracts International, Volume: 63-01, Section: B, page: 0466.
502 $a Thesis (Ph.D.)--University of California, Irvine, 2002.
520 $a The back-end packaging process is the remaining challenge for the micromachining industry to commercialize microsystem technology (MST) devices at low cost. This dissertation presents a novel wafer level protection technique as a final step of the front-end fabrication process for MSTs. It facilitates improved manufacturing throughput and automation in package assembly, wafer level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized micro-cap array, which consists of an assortment of small caps micro-molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments during packaging. The micro-cap array is first constructed by a micromachining process with micro-molding technique, then sealed to the device wafer at wafer level. Epoxy-based wafer-level micro cap array has been successfully fabricated and showed good compatibility with conventional back-end packaging processes. An adhesive transfer technique was demonstrated to seal the micro cap array with a MEMS device wafer. No damage or gross leak was observed while wafer dicing or later during a gross leak test. Applications of the micro cap array are demonstrated on MEMS, microactuators fabricated using CRONOS MUMPS process. Depending on the application needs, the micro-molded cap can be designed and modified to facilitate additional component functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. Successful fabrication of a micro cap array comprised with microlenses can provide active functions as well as passive protection. An optical tweezer array could be one possibility for applications of a micro cap with microlenses. The micro cap itself could serve as micro well for DNA or bacteria amplification as well.
590 $a School code: 0030.
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0549
690 $a 0794
710 2 0 $a University of California, Irvine. $3 705821
773 0 $t Dissertation Abstracts International $g 63-01B.
790 $a 0030
790 1 0 $a Li, Guann-Pyng, $e advisor
791 $a Ph.D.
792 $a 2002
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3039195