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Encapsulation technologies for elect...

Pecht, Michael G.

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Encapsulation technologies for electronic applications

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Encapsulation technologies for electronic applications/ Haleh Ardebili, Michael G. Pecht.
Author:	Ardebili, Haleh.
other author:	Pecht, Michael G.
Published:	Burlington, MA :William Andrew, : 2009.,
Description:	xvii, 480 p. :ill. ;24 cm.
Subject:	Electronic apparatus and appliances - Plastic embedment. -
Online resource:	http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780815515760An electronic book accessible through the World Wide Web; click for information
Online resource:	http://www.sciencedirect.com/science/book/9780815515760An electronic book accessible through the World Wide Web; click for information
ISBN:	0815515766

Encapsulation technologies for electronic applications
Ardebili, Haleh.

Encapsulation technologies for electronic applications[electronic resource] /Haleh Ardebili, Michael G. Pecht. - Burlington, MA :William Andrew,2009. - xvii, 480 p. :ill. ;24 cm. - Materials and processes for electronic applications series. - Materials and processes for electronic applications series..

Includes bibliographical references and index.

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. . Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics . Coverage of environmentally friendly 'green encapsulants' . Practical coverage of faults and defects: how to analyze them and how to avoid them  .

Electronic reproduction.
Amsterdam :
Elsevier Science & Technology,
2010.

Mode of access: World Wide Web.

ISBN: 0815515766

Source: 154020:154180Elsevier Science & Technologyhttp://www.sciencedirect.comSubjects--Topical Terms:

1068323
Electronic apparatus and appliances
--Plastic embedment.Index Terms--Genre/Form:

542853
Electronic books.

LC Class. No.: TK7871

Dewey Class. No.: 621.381

Encapsulation technologies for electronic applications
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003 OCoLC
005 20101126
006 m d
007 cr cn|||||||||
008 101126s2009 maua sb 001 0 eng d
020 $a 0815515766
020 $a 9780815515760
035 $a (OCoLC)500579949
035 $a ocn500579949
037 $a 154020:154180 $b Elsevier Science & Technology $n http://www.sciencedirect.com
040 $a OPELS $b eng $c OPELS
049 $a TEFA
050 1 4 $a TK7871
082 0 4 $a 621.381 $2 22
100 1 $a Ardebili, Haleh. $3 1068322
245 0 0 $a Encapsulation technologies for electronic applications $h [electronic resource] / $c Haleh Ardebili, Michael G. Pecht.
260 $a Burlington, MA : $c 2009. $b William Andrew,
300 $a xvii, 480 p. : $b ill. ; $c 24 cm.
490 1 $a Materials and processes for electronic applications series
504 $a Includes bibliographical references and index.
520 $a Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. . Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics . Coverage of environmentally friendly 'green encapsulants' . Practical coverage of faults and defects: how to analyze them and how to avoid them  .
533 $a Electronic reproduction. $b Amsterdam : $c Elsevier Science & Technology, $d 2010. $n Mode of access: World Wide Web. $n System requirements: Web browser. $n Title from title screen (viewed on Jan. 14, 2010). $n Access may be restricted to users at subscribing institutions.
650 0 $a Electronic apparatus and appliances $x Plastic embedment. $3 1068323
655 7 $a Electronic books. $2 lcsh $3 542853
700 1 $a Pecht, Michael G. $3 1068321
710 2 $a ScienceDirect (Online service) $3 848416
830 0 $a Materials and processes for electronic applications series. $3 1068324
856 4 0 $3 Referex $u http://www.engineeringvillage.com/controller/servlet/OpenURL?genre=book&isbn=9780815515760 $z An electronic book accessible through the World Wide Web; click for information
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9780815515760 $z An electronic book accessible through the World Wide Web; click for information
994 $a C0 $b TEF