電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relati...
王鼎翔

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  • 電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: 電路板電鍍銅箔之組織與機性特徵相關性探討 = / 王鼎翔撰
    Reminder of title: The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
    remainder title: The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications
    Author: 王鼎翔
    other author: 宋振銘
    Published: [花蓮縣壽豐鄉] : [國立東華大學材料科學與工程學系], : 民99[2010],
    Description: 10,70面 : 圖,表 ; 30公分
    Notes: 本論文公開閱覽日期為2011年7月14日
    Subject: 銅箔 -
    Online resource: http://hdl.handle.net/11296/3sgud8PDF全文
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  • 1 records • Pages 1 •
 
GE0110778 五樓論文區 (5F Theses & Dissertations) 03.不外借_N 本校碩士論文 T 440.3 1028 2010 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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