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電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relati...
~
王鼎翔
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電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
電路板電鍍銅箔之組織與機性特徵相關性探討 = / 王鼎翔撰
Reminder of title:
The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
remainder title:
The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications
Author:
王鼎翔
other author:
宋振銘
Published:
[花蓮縣壽豐鄉] : [國立東華大學材料科學與工程學系], : 民99[2010],
Description:
10,70面 : 圖,表 ; 30公分
Notes:
本論文公開閱覽日期為2011年7月14日
Subject:
銅箔 -
Online resource:
http://hdl.handle.net/11296/3sgud8PDF全文
電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
王鼎翔
電路板電鍍銅箔之組織與機性特徵相關性探討 =
The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications / The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications王鼎翔撰 - [花蓮縣壽豐鄉] : [國立東華大學材料科學與工程學系], 民99[2010] - 10,70面 : 圖,表 ; 30公分
本論文公開閱覽日期為2011年7月14日
碩士論文--國立東華大學材料科學與工程學系,2010
參考書目:面69-70Subjects--Topical Terms:
2933930
銅箔
電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
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based on 0 review(s)
Location:
ALL
五樓論文區 (5F Theses & Dissertations)
Year:
Volume Number:
Items
1 records • Pages 1 •
1
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Attachments
GE0110778
五樓論文區 (5F Theses & Dissertations)
03.不外借_N
本校碩士論文
T 440.3 1028 2010
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1 records • Pages 1 •
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