Reliability evaluation and damage re...
University of Illinois at Urbana-Champaign.

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  • Reliability evaluation and damage reduction of woodframe buildings under seismic loads.
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Reliability evaluation and damage reduction of woodframe buildings under seismic loads./
    Author: Liang, Hao.
    Description: 242 p.
    Notes: Adviser: Yi-Kwei Wen.
    Contained By: Dissertation Abstracts International69-02B.
    Subject: Engineering, Civil. -
    Online resource: http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3301183
    ISBN: 9780549463153
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