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Advanced wirebond interconnection te...

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Advanced wirebond interconnection technology

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Advanced wirebond interconnection technology/ by Shankara K. Prasad.
作者:	Prasad, Shankara K.
出版者:	Boston :Kluwer Academic Publishers, : c2004.,
面頁冊數:	xxviii, 668 p. :ill., digital ;24 cm.
Contained By:	Springer e-books
標題:	Electronic packaging - Reliability. -
電子資源:	http://dx.doi.org/10.1007/b105273
ISBN:	9781402077623 (paper)

Advanced wirebond interconnection technology
Prasad, Shankara K.

Advanced wirebond interconnection technology[electronic resource] /by Shankara K. Prasad. - Boston :Kluwer Academic Publishers,c2004. - xxviii, 668 p. :ill., digital ;24 cm.

ISBN: 9781402077623 (paper)Subjects--Topical Terms:

821560
Electronic packaging
--Reliability.

LC Class. No.: TK7836 / .P715 2004

Dewey Class. No.: 621.381046

Advanced wirebond interconnection technology
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050 0 0 $a TK7836 $b .P715 2004
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100 1 $a Prasad, Shankara K. $3 821559
245 1 0 $a Advanced wirebond interconnection technology $h [electronic resource] / $c by Shankara K. Prasad.
260 $a Boston : $c c2004. $b Kluwer Academic Publishers,
300 $a xxviii, 668 p. : $b ill., digital ; $c 24 cm.
650 0 $a Electronic packaging $x Reliability. $3 821560
650 0 $a Wire bonding (Electronic packaging) $x Production control. $3 821561
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856 4 0 $u http://dx.doi.org/10.1007/b105273
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