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添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 ...

劉耀仁

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添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = / 劉耀仁撰
Reminder of title:	Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /
remainder title:	Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints
Author:	劉耀仁
other author:	宋振銘
Published:	[花蓮縣壽豐鄉 : 國立東華大學材料科學與工程學系], : 民98[2009],
Description:	9,76面 : 圖,表 ; 30公分
Notes:	指導教授︰宋振銘
Subject:	無鉛銲料 -
Online resource:	http://hdl.handle.net/11296/8qthc4PDF全文

添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /
劉耀仁

添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints / Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints劉耀仁撰 - [花蓮縣壽豐鄉 : 國立東華大學材料科學與工程學系], 民98[2009] - 9,76面 : 圖,表 ; 30公分

指導教授︰宋振銘

碩士論文--國立東華大學材料科學與工程學系,2009

參考書目︰面71-76Subjects--Topical Terms:

2613177
無鉛銲料

添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /
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