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球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallu...

徐福聲

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球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = / 徐福聲撰
Reminder of title:	Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /
remainder title:	Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints
Author:	徐福聲
other author:	宋振銘
Published:	[花蓮縣壽豐鄉 : 國立東華大學材料科學與工程學系], : 民98[2009],
Description:	9,74面 : 圖,表 ; 30公分
Notes:	指導教授︰宋振銘
Subject:	摔落試驗 -
Online resource:	http://hdl.handle.net/11296/8u8y8fPDF全文

球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /
徐福聲

球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints / Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints徐福聲撰 - [花蓮縣壽豐鄉 : 國立東華大學材料科學與工程學系], 民98[2009] - 9,74面 : 圖,表 ; 30公分

指導教授︰宋振銘

碩士論文--國立東華大學材料科學與工程學系,2009

參考書目︰面71-74Subjects--Topical Terms:

2880164
摔落試驗

球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /
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