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1993 proceedings /

Lea, R. M., (1943-)

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1993 proceedings /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	1993 proceedings // Fifth Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA ; sponsored by IEEE Computer Society, IEEE Components, Hybrids & Manufacturing Technology Society ; edited by Peter W. Wyatt and R. Mike Lea.
other author:	Lea, R. M.,
corporate name:	International Conference on Wafer Scale Integration
Published:	[New York, NY] :Institute of Electrical and Electronics Engineers ; : c1993.,
Description:	ix, 374 p. :ill. ;24 cm.
Notes:	"IEEE catalog number 93CH3227-6"--T.p. verso.
Subject:	Integrated circuits - Wafer-scale integration -
ISBN:	0780308670 (casebound)

1993 proceedings /
1993 proceedings /Fifth Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA ; sponsored by IEEE Computer Society, IEEE Components, Hybrids & Manufacturing Technology Society ; edited by Peter W. Wyatt and R. Mike Lea. - [New York, NY] :Institute of Electrical and Electronics Engineers ;c1993. - ix, 374 p. :ill. ;24 cm.

"IEEE catalog number 93CH3227-6"--T.p. verso.

Includes bibliographical references and index.

ISBN: 0780308670 (casebound)

LCCN: 92054780Subjects--Topical Terms:

695859
Integrated circuits
--Wafer-scale integration

LC Class. No.: TK7874 / .I578 1993

Dewey Class. No.: 621.395 / In8p, 1993

1993 proceedings /
LDR:01058cam a2200229 a 45 001 666571
003 OCoLC
005 19951107161832.0
008 930401s1993 nyua b 101 0 eng d
010 $a 92054780
020 $a 0780308670 (casebound)
020 $a 0780308689 (microfiche)
035 $a dt 00015180
040 $a EZT $c EZT $d UIU
050 $a TK7874 $b .I578 1993
082 0 $a 621.395 $b In8p, 1993 $2 20
111 $a International Conference on Wafer Scale Integration $n (5th : $d 1993 : $c San Francisco, Calif.) $3 695860
245 1 0 $a 1993 proceedings / $c Fifth Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA ; sponsored by IEEE Computer Society, IEEE Components, Hybrids & Manufacturing Technology Society ; edited by Peter W. Wyatt and R. Mike Lea.
260 $a [New York, NY] : $a Piscataway, NJ : $c c1993. $b Institute of Electrical and Electronics Engineers ; $b Additional copies from IEEE Service Center,
300 $a ix, 374 p. : $b ill. ; $c 24 cm.
500 $a "IEEE catalog number 93CH3227-6"--T.p. verso.
500 $a Spine and cover title: 1993 IEEE International Conference on Wafer Scale Integration.
504 $a Includes bibliographical references and index.
650 $a Integrated circuits $x Wafer-scale integration $x Congresses. $3 695859
700 $a Lea, R. M., $d 1943- $3 649269
700 $a Wyatt, Peter W. $3 695856
710 $a IEEE Components, Hybrids, and Manufacturing Technology Society. $3 695857
710 $a IEEE Computer Society. $3 590273
740 0 1 $a 1993 IEEE International Conference on Wafer Scale Integration.