Integrated circuit, hybrid, and mult...
Pecht, Michael.

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  • Integrated circuit, hybrid, and multichip module package design guidelines : = a focus on reliability /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Integrated circuit, hybrid, and multichip module package design guidelines :/ [edited by] Michael Pecht.
    Reminder of title: a focus on reliability /
    other author: Pecht, Michael.
    Published: New York :Wiley, : c1994.,
    Description: xxxi, 426 p. :ill. ;25 cm.
    Notes: "A Wiley-Interscience publication."
    Subject: Electronic packaging - Design. -
    ISBN: 0471594466 (cloth : alk. paper)
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  • 1 records • Pages 1 •
 
W0011234 罕用書庫221室(美崙校區,調書請點預約)(RU_221) 01.外借(書)_YB 一般圖書 TK7870.15 I61 1994 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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