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Effects of Adding Nickel and Bismuth...

Bandayagari, Jyothsna,

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Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows // Jyothsna Bandayagari.
Author:	Bandayagari, Jyothsna,
Description:	1 electronic resource (96 pages)
Notes:	Source: Masters Abstracts International, Volume: 85-12.
Contained By:	Masters Abstracts International85-12.
Subject:	Industrial engineering. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31296580
ISBN:	9798383135860

Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows /
Bandayagari, Jyothsna,

Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows /Jyothsna Bandayagari. - 1 electronic resource (96 pages)

Source: Masters Abstracts International, Volume: 85-12.

SAC has been identified as a promising alternative to lead-based solders for second-level interconnects, offering a comprehensive solution that aligns with diverse reliability standards. This includes attributes such as high strength, remarkable resistance to creep, prolonged thermal fatigue endurance, and satisfactory shock performance. However, it is seen that SAC alloy properties i.e., the shear strength of the solder joint gets degraded under high temperature and multiple reflow conditions. Additionally, there is an observed increase in Intermetallic Compound (IMC) thickness with these testing conditions. Consequently, alloying SAC at different percentage weights brings unique properties to the solder joint reliability. Nickel and Bismuth when added to SAC improve mechanical strength and aging resistance. Therefore, the main objective of the thesis is to understand the effects of adding the alloying elements i.e., Ni and Bi in SAC for isothermal aging and multiple reflow conditions. To determine the shear strength of the unassembled packages, the ball shear test of the test vehicle was performed after the test vehicle was subjected to the testing conditions (isothermal aging and multiple reflow). Furthermore, IMC thickness was measured for both assembled and unassembled samples under these conditions to understand the impact of assembly of the package onto PCB board for assembled packages. It was observed that the shear strength of SAC+Ni+Bi outperformed SAC305 by 30% for isothermal aging conditions and 25% for multiple reflow conditions. In addition to this, IMC growth rate was slow for SAC+Ni+Bi in comparison to SAC305 for unassembled packages. This study finally concludes that SAC+Ni+Bi outperformed SAC305 for both isothermal aging and multiple reflow conditions. Hence, SAC+Ni+Bi solder alloys could be employed for high reliability applications.

English

ISBN: 9798383135860Subjects--Topical Terms:

526216
Industrial engineering.
Subjects--Index Terms:

High temperature applications

Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows /
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245 1 0 $a Effects of Adding Nickel and Bismuth in SAC Solder for Second Level Interconnects Under Aging and Multiple Reflows / $c Jyothsna Bandayagari.
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300 $a 1 electronic resource (96 pages)
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520 $a SAC has been identified as a promising alternative to lead-based solders for second-level interconnects, offering a comprehensive solution that aligns with diverse reliability standards. This includes attributes such as high strength, remarkable resistance to creep, prolonged thermal fatigue endurance, and satisfactory shock performance. However, it is seen that SAC alloy properties i.e., the shear strength of the solder joint gets degraded under high temperature and multiple reflow conditions. Additionally, there is an observed increase in Intermetallic Compound (IMC) thickness with these testing conditions. Consequently, alloying SAC at different percentage weights brings unique properties to the solder joint reliability. Nickel and Bismuth when added to SAC improve mechanical strength and aging resistance. Therefore, the main objective of the thesis is to understand the effects of adding the alloying elements i.e., Ni and Bi in SAC for isothermal aging and multiple reflow conditions. To determine the shear strength of the unassembled packages, the ball shear test of the test vehicle was performed after the test vehicle was subjected to the testing conditions (isothermal aging and multiple reflow). Furthermore, IMC thickness was measured for both assembled and unassembled samples under these conditions to understand the impact of assembly of the package onto PCB board for assembled packages. It was observed that the shear strength of SAC+Ni+Bi outperformed SAC305 by 30% for isothermal aging conditions and 25% for multiple reflow conditions. In addition to this, IMC growth rate was slow for SAC+Ni+Bi in comparison to SAC305 for unassembled packages. This study finally concludes that SAC+Ni+Bi outperformed SAC305 for both isothermal aging and multiple reflow conditions. Hence, SAC+Ni+Bi solder alloys could be employed for high reliability applications.
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590 $a School code: 0792
650 4 $a Industrial engineering. $3 526216
650 4 $a Materials science. $3 543314
650 4 $a Packaging. $3 585030
653 $a High temperature applications
653 $a IMC thickness
653 $a Lead free alloys
653 $a Reliability
653 $a SAC alloys
653 $a Shear strength
690 $a 0546
690 $a 0794
690 $a 0549
710 2 $a State University of New York at Binghamton. $b Systems Science Industrial Engineering. $e degree granting institution. $3 3765714
720 1 $a Zhou, Yingge $e degree supervisor.
720 1 $a Patel, Darshil $e degree supervisor.
773 0 $t Masters Abstracts International $g 85-12.
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792 $a 2024
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