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A novel method for the curing of met...

Roberson, David Adrian,

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A novel method for the curing of metal particle loaded conductive inks and pastes /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A novel method for the curing of metal particle loaded conductive inks and pastes // David Adrian Roberson.
作者:	Roberson, David Adrian,
面頁冊數:	1 electronic resource (163 pages)
附註:	Source: Dissertations Abstracts International, Volume: 74-01, Section: B.
Contained By:	Dissertations Abstracts International74-01B.
標題:	Inorganic chemistry. -
電子資源:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3512749
ISBN:	9781267420138

A novel method for the curing of metal particle loaded conductive inks and pastes /
Roberson, David Adrian,

A novel method for the curing of metal particle loaded conductive inks and pastes /David Adrian Roberson. - 1 electronic resource (163 pages)

Source: Dissertations Abstracts International, Volume: 74-01, Section: B.

The emerging technology of printed microelectronics involving the use of conductive inks in conjunction with standard printing techniques offers a fast and low waste method for creating microelectronics compared with standard manufacturing processes. A clear path to the creation of flexible electronics is present due to the ease of printing on flexible substrates. Moreover, creation of novel 3D structural electronics is possible via the integration of printing technologies and additive manufacturing (AM) techniques. A key obstacle to the manufacturing of flexible and structural electronics comes from the temperature restrictions imposed by the substrates, which are typically polymeric. This hindrance has the effect of limiting the thermal cure cycles necessary to create the maximum electrical performance of conductive traces printed with conductive ink, which must be thermally cured. Whether the ink has micro-scale conductive particles, nano-scale conductive particles, or is organometallic in nature, all conductive inks need some sort of thermal curing to perform properly. The research presented in this dissertation entails the development of a curing technique which creates the optimal electrical performance in conductive traces created from conductive ink on both flexible and 3D polymeric substrates. The utilization of ohmic heating in conjunction with and in lieu of thermal curing is shown to decrease the resistivity of conductive traces printed form conductive inks and pastes. Microstructural characterization was performed on successful and unsuccessful (electrically failed) specimens. A process characterization of the creation of a via/interconnect system in a 3D freeform was made and involved electrical characterization and printable conductor selection. Initial research involving electrical and microstructural characterization of the thermal curing process is presented along with novel findings showing the impact of inkjet printing procedure on the resulting electrical resistivity. Also, a failure analysis of a component from a direct write equipment set was made.

English

ISBN: 9781267420138Subjects--Topical Terms:

3173556
Inorganic chemistry.
Subjects--Index Terms:

Conductive inks

A novel method for the curing of metal particle loaded conductive inks and pastes /
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300 $a 1 electronic resource (163 pages)
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500 $a Source: Dissertations Abstracts International, Volume: 74-01, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisors: MacDonald, Eric W. Committee members: Botez, Cristian E.; Murr, Lawrence E.; Saupe, Geoffrey B.; Wicker, Ryan B.
502 $b Ph.D. $c The University of Texas at El Paso $d 2012.
520 $a The emerging technology of printed microelectronics involving the use of conductive inks in conjunction with standard printing techniques offers a fast and low waste method for creating microelectronics compared with standard manufacturing processes. A clear path to the creation of flexible electronics is present due to the ease of printing on flexible substrates. Moreover, creation of novel 3D structural electronics is possible via the integration of printing technologies and additive manufacturing (AM) techniques. A key obstacle to the manufacturing of flexible and structural electronics comes from the temperature restrictions imposed by the substrates, which are typically polymeric. This hindrance has the effect of limiting the thermal cure cycles necessary to create the maximum electrical performance of conductive traces printed with conductive ink, which must be thermally cured. Whether the ink has micro-scale conductive particles, nano-scale conductive particles, or is organometallic in nature, all conductive inks need some sort of thermal curing to perform properly. The research presented in this dissertation entails the development of a curing technique which creates the optimal electrical performance in conductive traces created from conductive ink on both flexible and 3D polymeric substrates. The utilization of ohmic heating in conjunction with and in lieu of thermal curing is shown to decrease the resistivity of conductive traces printed form conductive inks and pastes. Microstructural characterization was performed on successful and unsuccessful (electrically failed) specimens. A process characterization of the creation of a via/interconnect system in a 3D freeform was made and involved electrical characterization and printable conductor selection. Initial research involving electrical and microstructural characterization of the thermal curing process is presented along with novel findings showing the impact of inkjet printing procedure on the resulting electrical resistivity. Also, a failure analysis of a component from a direct write equipment set was made.
546 $a English
590 $a School code: 0459
650 4 $a Inorganic chemistry. $3 3173556
650 4 $a Electrical engineering. $3 649834
650 4 $a Materials science. $3 543314
653 $a Conductive inks
653 $a Metal particles
653 $a Microscopy
653 $a Pastes
653 $a Printed electronics
690 $a 0488
690 $a 0544
690 $a 0794
710 2 $a The University of Texas at El Paso. $b Matl. Sci. And Engin.. $e degree granting institution. $3 3815725
720 1 $a MacDonald, Eric W. $e degree supervisor.
773 0 $t Dissertations Abstracts International $g 74-01B.
790 $a 0459
791 $a Ph.D.
792 $a 2012
856 4 0 $u https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3512749