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Design and modeling for 3D ICs and i...

Swaminathan, Madhavan,

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Design and modeling for 3D ICs and interposers /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Design and modeling for 3D ICs and interposers // Madhavan Swaminathan, Georgia Institute of Technology, USA ; Ki Jin Han, Ulsan National Institute of Science and Technology (UNIST), Korea.
Author:	Swaminathan, Madhavan,
other author:	Han, Ki Jin,
Published:	New Jersey :World Scientific, : [2014],
Description:	xxi, 354 pages :illustrations (some color) ;24 cm.
Subject:	Three-dimensional integrated circuits. -
ISBN:	9789814508599

Design and modeling for 3D ICs and interposers /
Swaminathan, Madhavan,

Design and modeling for 3D ICs and interposers /Madhavan Swaminathan, Georgia Institute of Technology, USA ; Ki Jin Han, Ulsan National Institute of Science and Technology (UNIST), Korea. - New Jersey :World Scientific,[2014] - xxi, 354 pages :illustrations (some color) ;24 cm. - WSPC series in advanced integration and packaging ;vol. 2. - WSPC series in advanced integration and packaging ;vol. 2..

Includes bibliographical references and index.

System integration and modeling concepts --

ISBN: 9789814508599

LCCN: 2015430728Subjects--Topical Terms:

2142302
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893 / .S93 2014

Design and modeling for 3D ICs and interposers /
LDR:01198cam a2200229 i 4500 001 2427066
005 20250607064514.5
008 260915t20142014njua b 001 0 eng d
010 $a 2015430728
020 $a 9789814508599
020 $a 9814508594
035 $a 18680548
035 $a (OCoLC)869548376
035 $a 18680548
040 $a NPS $b eng $c NPS $d OCLCO $d UKMGB $d LML $d OCLCF $d CDX $d YDXCP $d BTCTA $d XII $d DLC
042 $a lccopycat
050 0 0 $a TK7874.893 $b .S93 2014
100 1 $a Swaminathan, Madhavan, $e author. $3 3813659
245 1 0 $a Design and modeling for 3D ICs and interposers / $c Madhavan Swaminathan, Georgia Institute of Technology, USA ; Ki Jin Han, Ulsan National Institute of Science and Technology (UNIST), Korea.
260 # $a New Jersey : $b World Scientific, $c [2014]
300 $a xxi, 354 pages : $b illustrations (some color) ; $c 24 cm.
490 1 $a WSPC series in advanced integration and packaging ; $v vol. 2
504 $a Includes bibliographical references and index.
505 1 0 $t System integration and modeling concepts -- $t Modeling of cylindrical interconnections -- $t Electrical modeling of through silicon vias -- $t Electrical performance and signal integrity -- $t Power distribution, return path discontinuities and thermal management -- $t Alternate methods for power distribution.
650 # 0 $a Three-dimensional integrated circuits. $3 2142302
700 1 # $a Han, Ki Jin, $e author. $3 3813660
830 0 $a WSPC series in advanced integration and packaging ; $v vol. 2. $3 3813661