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Hybrid bonding, advanced substrates,...

Lau, John.

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Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration

Record Type:	Electronic resources : Monograph/item
Title/Author:	Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration/ by John Lau, Xuejun Fan.
Author:	Lau, John.
other author:	Fan, X. J.
Published:	Singapore :Springer Nature Singapore : : 2025.,
Description:	xxiv, 645 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:	Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management.
Contained By:	Springer Nature eBook
Subject:	Printed circuits - Design and construction. -
Online resource:	https://doi.org/10.1007/978-981-96-4166-6
ISBN:	9789819641666

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
Lau, John.

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration[electronic resource] /by John Lau, Xuejun Fan. - Singapore :Springer Nature Singapore :2025. - xxiv, 645 p. :ill. (some col.), digital ;24 cm.

Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management.

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

ISBN: 9789819641666

Standard No.: 10.1007/978-981-96-4166-6doiSubjects--Topical Terms:

649335
Printed circuits
--Design and construction.

LC Class. No.: TK7868.P7

Dewey Class. No.: 621.381531

Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration
LDR:02497nmm a2200325 a 4500 001 2410182
003 DE-He213
005 20250518130237.0
006 m d
007 cr nn 008maaau
008 260204s2025 si s 0 eng d
020 $a 9789819641666 $q (electronic bk.)
020 $a 9789819641659 $q (paper)
024 7 $a 10.1007/978-981-96-4166-6 $2 doi
035 $a 978-981-96-4166-6
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7868.P7
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
072 7 $a TJFC $2 thema
082 0 4 $a 621.381531 $2 23
090 $a TK7868.P7 $b L366 2025
100 1 $a Lau, John. $3 3783904
245 1 0 $a Hybrid bonding, advanced substrates, failure mechanisms, and thermal management for chiplets and heterogeneous integration $h [electronic resource] / $c by John Lau, Xuejun Fan.
260 $a Singapore : $b Springer Nature Singapore : $b Imprint: Springer, $c 2025.
300 $a xxiv, 645 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management.
520 $a The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
650 0 $a Printed circuits $x Design and construction. $3 649335
650 0 $a Integrated circuits $x Design and construction. $3 658490
650 0 $a Adhesives. $3 871837
650 1 4 $a Electronics Design and Verification. $3 3592716
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Semiconductors. $3 516162
650 2 4 $a Process Engineering. $3 3591945
700 1 $a Fan, X. J. $3 3783905
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-981-96-4166-6
950 $a Engineering (SpringerNature-11647)