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Proceedings of the Green Materials a...

Electronic Packaging Interconnect Technology Symposium ((2024 :)

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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium/ edited by Nurul Razliana Abdul Razak ... [et al.].
其他題名:	EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
其他題名:	EPITS 2024
其他作者:	Abdul Razak, Nurul Razliana.
團體作者:	Electronic Packaging Interconnect Technology Symposium
出版者:	Singapore :Springer Nature Singapore : : 2025.,
面頁冊數:	xiii, 421 p. :ill., digital ;24 cm.
內容註:	Electronic Packaging -- Advanced Materials -- Green Materials -- Surface Coating.
Contained By:	Springer Nature eBook
標題:	Electronic packaging - Congresses. -
電子資源:	https://doi.org/10.1007/978-981-96-2871-1
ISBN:	9789819628711

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /[electronic resource] :EPITS 2024edited by Nurul Razliana Abdul Razak ... [et al.]. - Singapore :Springer Nature Singapore :2025. - xiii, 421 p. :ill., digital ;24 cm. - Springer proceedings in physics,4181867-4941 ;. - Springer proceedings in physics ;418..

Electronic Packaging -- Advanced Materials -- Green Materials -- Surface Coating.

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.

ISBN: 9789819628711

Standard No.: 10.1007/978-981-96-2871-1doiSubjects--Topical Terms:

649467
Electronic packaging
--Congresses.

LC Class. No.: TK7870.15 / .E54 2024

Dewey Class. No.: 621.381046

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium = EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
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