晶圓代工與先進封裝產業科技實務 = Wafer foundry and ...
曲建仲

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  • 晶圓代工與先進封裝產業科技實務 = Wafer foundry and advanced packaging technologies : industrial practices and applications /
  • Record Type: Electronic resources : Monograph/item
    Title/Author: 晶圓代工與先進封裝產業科技實務/ 曲建仲作
    Reminder of title: Wafer foundry and advanced packaging technologies : industrial practices and applications /
    remainder title: Wafer foundry and advanced packaging technologies :
    Author: 曲建仲
    Published: [臺北市] :知識力科技 ; : 2025[民114],
    Description: 294面 :彩圖, 表
    Notes: 資料型式 : 文字
    Subject: 半導體 -
    Online resource: https://ndhu.ebook.hyread.com.tw/bookDetail.jsp?id=474190HyRead ebook電子書
    ISBN: 9786264015738
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  • 1 records • Pages 1 •
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