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Closed-Loop Pulsed Flash Cooling for...

Pugazhendhi, Rishi.

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Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics./
Author:	Pugazhendhi, Rishi.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2023,
Description:	72 p.
Notes:	Source: Masters Abstracts International, Volume: 85-06.
Contained By:	Masters Abstracts International85-06.
Subject:	Thermodynamics. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30815916
ISBN:	9798381171372

Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics.
Pugazhendhi, Rishi.

Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics. - Ann Arbor : ProQuest Dissertations & Theses, 2023 - 72 p.

Source: Masters Abstracts International, Volume: 85-06.

Thesis (M.S.)--University of California, Los Angeles, 2023.

As demand for high performance computing continues its rapid growth, the required digital processing capabilities necessitate more powerful integrated circuits. High power density chips produce a challenging thermal engineering problem by generating heat fluxes greater than 0.5 W/mm2 while sometimes providing diminishing provisions for heat spreading. A pressure-driven boiling approach, termed flash cooling, is considered here as a solution for high heat flux thermal management. The thesis study aims to improve the Technology Readiness Level of flash cooling for high heat flux electronic cooling applications, especially targeted for wafer-scale systems. Furthermore, the objective is also extended to understand the physics involved in flash cooling and associated limitations. A closed-loop flash cooling system is developed with evaporator, accumulator, vacuum pump, condenser, and reservoir. Methanol is employed as an operating fluid. Experiments are conducted by varying the heat flux from 0.2 W/mm2 to 1 W/mm2 and the corresponding flow rate varies from 0.13 ml/s to 1 ml/s. The experiment is conducted for 1800 seconds to achieve steady periodic conditions. The results indicate that the steady periodic temperature of the evaporator was below 85 {phono}{mllhring}C for heat fluxes up to 0.6 W/mm2 . The maximum oscillations in the evaporator temperature and pressure are determined to be {phono}{lstrok} 3.5 {phono}{mllhring}C and 9 kPa,{A0}respectively, for the heat flux corresponding to 1 W/mm2 . The crucial control parameter is determined to be pulse cycle time since the results suggest that a maximum feasible pulse cycle time exists for each heat flux above which conditions favoring stable vapor formation prevails. The maximum feasible pulse cycle time to avoid stable vapor formation is found to be 0.28 seconds for 1 W/mm2 . The correlations between control parameters are extrapolated and it can be utilized to ascertain the pulse cycle time and flow rate for a given heat flux to yield better cooling. The experiments not only prove the dynamic and transient cooling ability of pulsed flash cooling but also exhibit dry-out recovery characteristics under short pulse cycle times. Further research directions are also suggested to improve the flash cooling technology.{A0}

ISBN: 9798381171372Subjects--Topical Terms:

517304
Thermodynamics.
Subjects--Index Terms:

Boiling approach

Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics.
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245 1 0 $a Closed-Loop Pulsed Flash Cooling for High Heat Flux Electronics.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2023
300 $a 72 p.
500 $a Source: Masters Abstracts International, Volume: 85-06.
500 $a Advisor: Fisher, Timothy S.
502 $a Thesis (M.S.)--University of California, Los Angeles, 2023.
520 $a As demand for high performance computing continues its rapid growth, the required digital processing capabilities necessitate more powerful integrated circuits. High power density chips produce a challenging thermal engineering problem by generating heat fluxes greater than 0.5 W/mm2 while sometimes providing diminishing provisions for heat spreading. A pressure-driven boiling approach, termed flash cooling, is considered here as a solution for high heat flux thermal management. The thesis study aims to improve the Technology Readiness Level of flash cooling for high heat flux electronic cooling applications, especially targeted for wafer-scale systems. Furthermore, the objective is also extended to understand the physics involved in flash cooling and associated limitations. A closed-loop flash cooling system is developed with evaporator, accumulator, vacuum pump, condenser, and reservoir. Methanol is employed as an operating fluid. Experiments are conducted by varying the heat flux from 0.2 W/mm2 to 1 W/mm2 and the corresponding flow rate varies from 0.13 ml/s to 1 ml/s. The experiment is conducted for 1800 seconds to achieve steady periodic conditions. The results indicate that the steady periodic temperature of the evaporator was below 85 {phono}{mllhring}C for heat fluxes up to 0.6 W/mm2 . The maximum oscillations in the evaporator temperature and pressure are determined to be {phono}{lstrok} 3.5 {phono}{mllhring}C and 9 kPa,{A0}respectively, for the heat flux corresponding to 1 W/mm2 . The crucial control parameter is determined to be pulse cycle time since the results suggest that a maximum feasible pulse cycle time exists for each heat flux above which conditions favoring stable vapor formation prevails. The maximum feasible pulse cycle time to avoid stable vapor formation is found to be 0.28 seconds for 1 W/mm2 . The correlations between control parameters are extrapolated and it can be utilized to ascertain the pulse cycle time and flow rate for a given heat flux to yield better cooling. The experiments not only prove the dynamic and transient cooling ability of pulsed flash cooling but also exhibit dry-out recovery characteristics under short pulse cycle times. Further research directions are also suggested to improve the flash cooling technology.{A0}
590 $a School code: 0031.
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650 4 $a Mechanical engineering. $3 649730
653 $a Boiling approach
653 $a Electronic cooling
653 $a Flash cooling
653 $a Two-phase cooling
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773 0 $t Masters Abstracts International $g 85-06.
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793 $a English
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