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Thermal Management Techniques for 3D...

Gandhi, Rohit Mahavir.

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Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging./
Author:	Gandhi, Rohit Mahavir.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2024,
Description:	91 p.
Notes:	Source: Masters Abstracts International, Volume: 85-11.
Contained By:	Masters Abstracts International85-11.
Subject:	Mechanical engineering. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31237055
ISBN:	9798382325743

Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging.
Gandhi, Rohit Mahavir.

Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging. - Ann Arbor : ProQuest Dissertations & Theses, 2024 - 91 p.

Source: Masters Abstracts International, Volume: 85-11.

Thesis (M.S.)--Arizona State University, 2024.

The microelectronics industry is actively focusing on advanced packaging technologies, notably on three-dimensional stacking of heterogeneous integrated (3D-HI) circuits for enhanced performance. Despite its computational performance benefits, this approach faces challenges in thermal management due to increased power density and heat generation. Conventional cooling methods struggle to address this issue effectively. This study investigates microfluidic intralayer cooling techniques using analytical correlation and computational fluid dynamics (CFD) principles to propose a method capable of managing thermal performance across varying load conditions. The proposed configuration achieved a dissipation of 40 W/cm2 with a volumetric flow rate of 200 mL/min, maintaining chip temperature at 315K. Additionally, extreme hotspot conditions generating 1kW/cm2, along with the presence of thermal resistance from redistribution layers (RDLs), are analyzed. This research aims to establish a model for understanding geometric property variations under different heat flux conditions in 3D heterogeneous integration of semiconductor packaging.

ISBN: 9798382325743Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

Intralayer cooling techniques

Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging.
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245 1 0 $a Thermal Management Techniques for 3D Heterogenous Integration of Semiconductor Packaging.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2024
300 $a 91 p.
500 $a Source: Masters Abstracts International, Volume: 85-11.
500 $a Advisor: Wang, Robert.
502 $a Thesis (M.S.)--Arizona State University, 2024.
520 $a The microelectronics industry is actively focusing on advanced packaging technologies, notably on three-dimensional stacking of heterogeneous integrated (3D-HI) circuits for enhanced performance. Despite its computational performance benefits, this approach faces challenges in thermal management due to increased power density and heat generation. Conventional cooling methods struggle to address this issue effectively. This study investigates microfluidic intralayer cooling techniques using analytical correlation and computational fluid dynamics (CFD) principles to propose a method capable of managing thermal performance across varying load conditions. The proposed configuration achieved a dissipation of 40 W/cm2 with a volumetric flow rate of 200 mL/min, maintaining chip temperature at 315K. Additionally, extreme hotspot conditions generating 1kW/cm2, along with the presence of thermal resistance from redistribution layers (RDLs), are analyzed. This research aims to establish a model for understanding geometric property variations under different heat flux conditions in 3D heterogeneous integration of semiconductor packaging.
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650 4 $a Mechanical engineering. $3 649730
650 4 $a Engineering. $3 586835
650 4 $a Packaging. $3 585030
650 4 $a Fluid mechanics. $3 528155
653 $a Intralayer cooling techniques
653 $a Micro-pin fin heat sink
653 $a Microfluidic cooling
653 $a Semiconductor packaging
653 $a Thermal management
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690 $a 0537
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710 2 $a Arizona State University. $b Mechanical Engineering. $3 1675155
773 0 $t Masters Abstracts International $g 85-11.
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