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Materials Characterizations and Proc...

Richmond, Dylan J.,

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Materials Characterizations and Process Optimizations Enabling the Additive Fabrication of Electronics for RF, High-Power, and Device Packaging Applications /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Materials Characterizations and Process Optimizations Enabling the Additive Fabrication of Electronics for RF, High-Power, and Device Packaging Applications // Dylan J Richmond.
Author:	Richmond, Dylan J.,
Description:	1 electronic resource (226 pages)
Notes:	Source: Dissertations Abstracts International, Volume: 85-04, Section: B.
Contained By:	Dissertations Abstracts International85-04B.
Subject:	Materials science. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30631290
ISBN:	9798380567138

Materials Characterizations and Process Optimizations Enabling the Additive Fabrication of Electronics for RF, High-Power, and Device Packaging Applications /
Richmond, Dylan J.,

Materials Characterizations and Process Optimizations Enabling the Additive Fabrication of Electronics for RF, High-Power, and Device Packaging Applications /Dylan J Richmond. - 1 electronic resource (226 pages)

Source: Dissertations Abstracts International, Volume: 85-04, Section: B.

Flexible Hybrid Electronics (FHE) is an emerging field of electronics packaging that has garnered significant attention across various governments and industries for applications in wearable, health monitoring, automotive, aerospace, communication, Internet of Things (IoT), and high performance devices. The underpinning of FHE is the leverage of direct write printing technologies for functional material delivery to heterogeneously integrate with conventional silicon-based components. This has enabled both high and low power devices on flexible and 3D, additively manufactured platforms. At the core of FHE are functional (conductive, dielectric, photovoltaic, UV-activated, etc.) materials formulated into inks or pastes for on-demand fluid delivery. The robustness and functionality of a device is directly tied to the reliability of the fabrication process, bonds and microstructures formed between interconnecting materials surfaces. FHE devices for various applications have been reported by researchers, fabricated via different printing technologies, utilizing a wide range of inks and substrates with unique functionalities and properties. This dissertation discusses and evaluates materials, process development, and post-processing methods, along with reliability assessments and performance metrics applied to novel hybrid/additive systems.The recent electronics packaging and advanced manufacturing technologies that motivate the devices shown throughout this work are discussed. A matrix of low temperature silver-silver bonding solutions is investigated using aerosol jet printing and pneumatic dispensing of silver materials. Their mechanical, thermal, and power handling performance on common FHE, roll-to-roll (R2R) substrates is evaluated. This and other FHE packaging, fabrication, and post processing solutions are brought to a variety of sensing, communication, processing, and power devices. In general, each chapter contains a materials study/reliability evaluation, failure analysis, metrology, etc., followed by a device assembly and demonstration of functional performance. The physical limitations of the materials used to assemble devices are learned and lifetime expectations and failure mechanisms are mapped out.

English

ISBN: 9798380567138Subjects--Topical Terms:

543314
Materials science.
Subjects--Index Terms:

Aerosol jet printing

Materials Characterizations and Process Optimizations Enabling the Additive Fabrication of Electronics for RF, High-Power, and Device Packaging Applications /
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500 $a Source: Dissertations Abstracts International, Volume: 85-04, Section: B.
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520 $a Flexible Hybrid Electronics (FHE) is an emerging field of electronics packaging that has garnered significant attention across various governments and industries for applications in wearable, health monitoring, automotive, aerospace, communication, Internet of Things (IoT), and high performance devices. The underpinning of FHE is the leverage of direct write printing technologies for functional material delivery to heterogeneously integrate with conventional silicon-based components. This has enabled both high and low power devices on flexible and 3D, additively manufactured platforms. At the core of FHE are functional (conductive, dielectric, photovoltaic, UV-activated, etc.) materials formulated into inks or pastes for on-demand fluid delivery. The robustness and functionality of a device is directly tied to the reliability of the fabrication process, bonds and microstructures formed between interconnecting materials surfaces. FHE devices for various applications have been reported by researchers, fabricated via different printing technologies, utilizing a wide range of inks and substrates with unique functionalities and properties. This dissertation discusses and evaluates materials, process development, and post-processing methods, along with reliability assessments and performance metrics applied to novel hybrid/additive systems.The recent electronics packaging and advanced manufacturing technologies that motivate the devices shown throughout this work are discussed. A matrix of low temperature silver-silver bonding solutions is investigated using aerosol jet printing and pneumatic dispensing of silver materials. Their mechanical, thermal, and power handling performance on common FHE, roll-to-roll (R2R) substrates is evaluated. This and other FHE packaging, fabrication, and post processing solutions are brought to a variety of sensing, communication, processing, and power devices. In general, each chapter contains a materials study/reliability evaluation, failure analysis, metrology, etc., followed by a device assembly and demonstration of functional performance. The physical limitations of the materials used to assemble devices are learned and lifetime expectations and failure mechanisms are mapped out.
546 $a English
590 $a School code: 0792
650 4 $a Materials science. $3 543314
650 4 $a Systems science. $3 3168411
650 4 $a Mechanical engineering. $3 649730
653 $a Aerosol jet printing
653 $a Microwave antenna
653 $a Nanoparticle ink
653 $a Power electronics
653 $a Printed electronics
653 $a Thermal interface materials
690 $a 0794
690 $a 0548
690 $a 0790
710 2 $a State University of New York at Binghamton. $b Materials Science and Engineering. $e degree granting institution. $3 3765826
720 1 $a Poliks, Mark D. $e degree supervisor.
773 0 $t Dissertations Abstracts International $g 85-04B.
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791 $a Ph.D.
792 $a 2023
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