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Design of Substrate Integrated Waveg...

Toffel, Ryan.

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Design of Substrate Integrated Waveguide Filter Structures.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Design of Substrate Integrated Waveguide Filter Structures./
Author:	Toffel, Ryan.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2023,
Description:	73 p.
Notes:	Source: Masters Abstracts International, Volume: 85-06.
Contained By:	Masters Abstracts International85-06.
Subject:	Electrical engineering. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30817069
ISBN:	9798381154474

Design of Substrate Integrated Waveguide Filter Structures.
Toffel, Ryan.

Design of Substrate Integrated Waveguide Filter Structures. - Ann Arbor : ProQuest Dissertations & Theses, 2023 - 73 p.

Source: Masters Abstracts International, Volume: 85-06.

Thesis (M.S.)--University of Colorado Colorado Springs, 2023.

This item must not be sold to any third party vendors.

With the realization of next generation wireless networks (5G and 6G), highly integrated microwave modules are becoming more complex. Within a microwave module, the interconnect technology is used to integrate various components into a functional system. This includes not only the careful design of controlled impedance transmission lines, but also microwave circuits (such as filters, power dividers, and couplers). The interconnect is usually some form of multilayer technology such as a standard multi-layer printed circuit board (PCB), or a collection multi-layer planar structures connected to one another with wire-bonds. For frequencies above 20 GHz, the performance of the interconnecting structures is in the critical path, and methods of balancing cost, manufacturability, and performance become a large design hurdle. As manufacturing capabilities increase, Substrate integrated waveguide (SIW) interconnects are becoming more viable in the design of microwave modules. The increase in conductor surface area used by the propagating modes in a SIW allows for lower loss interconnects (and high Q-factor resonate structures) within a standard multi-layer process. When paired with the current low-loss dielectrics (e.g. Tachyon 100G), SIW circuits are a viable, low cost method of interconnecting and integrating a microwave system.In this research, the design of SIW filters operating in the K (18 - 27 GHz) and Ka (27 - 40 GHz) bands is explored in detail. Analysis techniques for impedance inverters are proposed, and the impact of parasitic elements on filter performance are demonstrated. A novel SIW surface mount diplexer is designed to operate on the 24 GHz and 28 GHz bands used for 5G MIMO applications. The diplexer is manufactured on an Alumina substrate, with an emphasis compactness and low loss. The prototype diplexer is built and measured to verify the manufacturability and electrical performance.

ISBN: 9798381154474Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Diplexer

Design of Substrate Integrated Waveguide Filter Structures.
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245 1 0 $a Design of Substrate Integrated Waveguide Filter Structures.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2023
300 $a 73 p.
500 $a Source: Masters Abstracts International, Volume: 85-06.
500 $a Advisor: Kalkur, Thottam S.
502 $a Thesis (M.S.)--University of Colorado Colorado Springs, 2023.
506 $a This item must not be sold to any third party vendors.
520 $a With the realization of next generation wireless networks (5G and 6G), highly integrated microwave modules are becoming more complex. Within a microwave module, the interconnect technology is used to integrate various components into a functional system. This includes not only the careful design of controlled impedance transmission lines, but also microwave circuits (such as filters, power dividers, and couplers). The interconnect is usually some form of multilayer technology such as a standard multi-layer printed circuit board (PCB), or a collection multi-layer planar structures connected to one another with wire-bonds. For frequencies above 20 GHz, the performance of the interconnecting structures is in the critical path, and methods of balancing cost, manufacturability, and performance become a large design hurdle. As manufacturing capabilities increase, Substrate integrated waveguide (SIW) interconnects are becoming more viable in the design of microwave modules. The increase in conductor surface area used by the propagating modes in a SIW allows for lower loss interconnects (and high Q-factor resonate structures) within a standard multi-layer process. When paired with the current low-loss dielectrics (e.g. Tachyon 100G), SIW circuits are a viable, low cost method of interconnecting and integrating a microwave system.In this research, the design of SIW filters operating in the K (18 - 27 GHz) and Ka (27 - 40 GHz) bands is explored in detail. Analysis techniques for impedance inverters are proposed, and the impact of parasitic elements on filter performance are demonstrated. A novel SIW surface mount diplexer is designed to operate on the 24 GHz and 28 GHz bands used for 5G MIMO applications. The diplexer is manufactured on an Alumina substrate, with an emphasis compactness and low loss. The prototype diplexer is built and measured to verify the manufacturability and electrical performance.
590 $a School code: 0892.
650 4 $a Electrical engineering. $3 649834
650 4 $a Electromagnetics. $3 3173223
650 4 $a Computer engineering. $3 621879
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653 $a Impedance inverters
653 $a Substrate integrated waveguide
653 $a Printed circuit board
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710 2 $a University of Colorado Colorado Springs. $b College of Engineering and Applied Science-Electrical Engineering. $3 3347367
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791 $a M.S.
792 $a 2023
793 $a English
856 4 0 $u https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30817069