Linked to FindBook      Google Book      Amazon      博客來     
  • 晶圓代工與先進封裝產業科技實務 = Wafer foundry and advanced package industry technology /
  • Record Type: Electronic resources : Monograph/item
    Title/Author: 晶圓代工與先進封裝產業科技實務/ 曲建仲作
    Reminder of title: Wafer foundry and advanced package industry technology /
    remainder title: Wafer foundry and advanced package industry technology
    Author: 曲建仲
    Published: 新北市 :全華, : 2023,
    Description: 279面 :彩圖
    Notes: 含索引
    Subject: 半導體 -
    Online resource: https://reading.udn.com/libnew/Redirect.jsp?T_ID=1523162&U_ID=ndhuudn讀書館
    ISBN: 9786263284166
Location:  Year:  Volume Number: 
Items
  • 1 records • Pages 1 •
  • 1 records • Pages 1 •
Multimedia
Reviews
Export
pickup library
 
 
Change password
Login