| Record Type: |
Electronic resources
: Monograph/item
|
| Title/Author: |
Advanced MEMS packaging/ John H. Lau ... [et al.]. |
| remainder title: |
Advanced microelectromechanical systems packaging. |
| other author: |
Lau, John H. |
| Published: |
New York :McGraw-Hill, : c2010., |
| Description: |
xxiii, 552 p. :ill. |
| [NT 15003449]: |
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. |
| Subject: |
Microelectromechanical systems. - |
| Online resource: |
https://lb30.libraryandbook.net/Book_detial/EB978007162623101Click for full text (McGrawHill) |
| ISBN: |
9780071626231 |