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Chiplet design and heterogeneous int...

Lau, John H.

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Chiplet design and heterogeneous integration packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Chiplet design and heterogeneous integration packaging/ by John H. Lau.
Author:	Lau, John H.
Published:	Singapore :Springer Nature Singapore : : 2023.,
Description:	xxii, 525 p. :ill., digital ;24 cm.
[NT 15003449]:	State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
Contained By:	Springer Nature eBook
Subject:	Integrated circuits - Design and construction. -
Online resource:	https://doi.org/10.1007/978-981-19-9917-8
ISBN:	9789811999178

Chiplet design and heterogeneous integration packaging
Lau, John H.

Chiplet design and heterogeneous integration packaging[electronic resource] /by John H. Lau. - Singapore :Springer Nature Singapore :2023. - xxii, 525 p. :ill., digital ;24 cm.

State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

ISBN: 9789811999178

Standard No.: 10.1007/978-981-19-9917-8doiSubjects--Topical Terms:

658490
Integrated circuits
--Design and construction.

LC Class. No.: TK7874

Dewey Class. No.: 621.3815

Chiplet design and heterogeneous integration packaging
LDR:02056nmm a2200325 a 4500 001 2317479
003 DE-He213
005 20230327132541.0
006 m d
007 cr nn 008maaau
008 230902s2023 si s 0 eng d
020 $a 9789811999178 $q (electronic bk.)
020 $a 9789811999161 $q (paper)
024 7 $a 10.1007/978-981-19-9917-8 $2 doi
035 $a 978-981-19-9917-8
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.3815 $2 23
090 $a TK7874 $b .L366 2023
100 1 $a Lau, John H. $3 858903
245 1 0 $a Chiplet design and heterogeneous integration packaging $h [electronic resource] / $c by John H. Lau.
260 $a Singapore : $b Springer Nature Singapore : $b Imprint: Springer, $c 2023.
300 $a xxii, 525 p. : $b ill., digital ; $c 24 cm.
505 0 $a State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding.
520 $a The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
650 0 $a Integrated circuits $x Design and construction. $3 658490
650 0 $a Microelectronic packaging. $3 699664
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Electronic Circuits and Systems. $3 3538814
650 2 4 $a Microsystems and MEMS. $3 3538640
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-981-19-9917-8
950 $a Engineering (SpringerNature-11647)