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Thermal reliability of power semicon...
~
Du, Xiong.
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Thermal reliability of power semiconductor device in the renewable energy system
Record Type:
Electronic resources : Monograph/item
Title/Author:
Thermal reliability of power semiconductor device in the renewable energy system/ by Xiong Du ... [et al.].
Author:
Du, Xiong.
Published:
Singapore :Springer Nature Singapore : : 2022.,
Description:
xvi, 172 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:
Introduction -- Thermal fatigue failure mechanism of power devices in renewable energy system -- Thermal model and thermal parameters monitoring -- Thermal analysis of power semiconductor device in renewable energy system -- Multi-time scale lifetime evaluation for the device in the renewable application -- Thermal management design and optimization -- Prospect.
Contained By:
Springer Nature eBook
Subject:
Power semiconductors. -
Online resource:
https://doi.org/10.1007/978-981-19-3132-1
ISBN:
9789811931321
Thermal reliability of power semiconductor device in the renewable energy system
Du, Xiong.
Thermal reliability of power semiconductor device in the renewable energy system
[electronic resource] /by Xiong Du ... [et al.]. - Singapore :Springer Nature Singapore :2022. - xvi, 172 p. :ill. (some col.), digital ;24 cm. - CPSS power electronics series,2520-8861. - CPSS power electronics series..
Introduction -- Thermal fatigue failure mechanism of power devices in renewable energy system -- Thermal model and thermal parameters monitoring -- Thermal analysis of power semiconductor device in renewable energy system -- Multi-time scale lifetime evaluation for the device in the renewable application -- Thermal management design and optimization -- Prospect.
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
ISBN: 9789811931321
Standard No.: 10.1007/978-981-19-3132-1doiSubjects--Topical Terms:
1047981
Power semiconductors.
LC Class. No.: TK7871.85
Dewey Class. No.: 621.38152
Thermal reliability of power semiconductor device in the renewable energy system
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This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
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W9444145
電子資源
11.線上閱覽_V
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EB TK7871.85
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