東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

MicroSystem based on SiP technology

Li, Suny.

Linked to FindBook

Google Book

Amazon

博客來

MicroSystem based on SiP technology

Record Type:	Electronic resources : Monograph/item
Title/Author:	MicroSystem based on SiP technology/ edited by Suny Li.
other author:	Li, Suny.
Published:	Singapore :Springer Nature Singapore : : 2022.,
Description:	xviii, 874 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:	From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.
Contained By:	Springer Nature eBook
Subject:	Integrated circuits - Design and construction. -
Online resource:	https://doi.org/10.1007/978-981-19-0083-9
ISBN:	9789811900839

MicroSystem based on SiP technology
MicroSystem based on SiP technology[electronic resource] /edited by Suny Li. - Singapore :Springer Nature Singapore :2022. - xviii, 874 p. :ill. (some col.), digital ;24 cm.

From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.

This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

ISBN: 9789811900839

Standard No.: 10.1007/978-981-19-0083-9doiSubjects--Topical Terms:

658490
Integrated circuits
--Design and construction.

LC Class. No.: TK7874 / .M53 2022

Dewey Class. No.: 621.3815

MicroSystem based on SiP technology
LDR:03524nmm a2200325 a 4500 001 2300424
003 DE-He213
005 20220528101918.0
006 m d
007 cr nn 008maaau
008 230324s2022 si s 0 eng d
020 $a 9789811900839 $q (electronic bk.)
020 $a 9789811900822 $q (paper)
024 7 $a 10.1007/978-981-19-0083-9 $2 doi
035 $a 978-981-19-0083-9
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874 $b .M53 2022
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.3815 $2 23
090 $a TK7874 $b .M626 2022
245 1 0 $a MicroSystem based on SiP technology $h [electronic resource] / $c edited by Suny Li.
260 $a Singapore : $b Springer Nature Singapore : $b Imprint: Springer, $c 2022.
300 $a xviii, 874 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.
520 $a This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
650 0 $a Integrated circuits $x Design and construction. $3 658490
650 0 $a Multichip modules (Microelectronics) $x Design and construction. $3 649440
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Semiconductors. $3 516162
650 2 4 $a Industrial and Production Engineering. $3 891024
700 1 $a Li, Suny. $3 3598846
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
856 4 0 $u https://doi.org/10.1007/978-981-19-0083-9
950 $a Engineering (SpringerNature-11647)