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Recent progress in lead-free solder ...

Mohd Arif Anuar Mohd Salleh.

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Recent progress in lead-free solder technology = materials development, processing and performances /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Recent progress in lead-free solder technology/ edited by Mohd Arif Anuar Mohd Salleh ... [et al.].
Reminder of title:	materials development, processing and performances /
other author:	Mohd Arif Anuar Mohd Salleh.
Published:	Cham :Springer International Publishing : : 2022.,
Description:	xii, 328 p. :ill., digital ;24 cm.
[NT 15003449]:	Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies.
Contained By:	Springer Nature eBook
Subject:	Solder and soldering - Technological innovations. -
Online resource:	https://doi.org/10.1007/978-3-030-93441-5
ISBN:	9783030934415

Recent progress in lead-free solder technology = materials development, processing and performances /
Recent progress in lead-free solder technologymaterials development, processing and performances /[electronic resource] :edited by Mohd Arif Anuar Mohd Salleh ... [et al.]. - Cham :Springer International Publishing :2022. - xii, 328 p. :ill., digital ;24 cm. - Topics in mining, metallurgy and materials engineering,2364-3307. - Topics in mining, metallurgy and materials engineering..

Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies.

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB) Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD) This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

ISBN: 9783030934415

Standard No.: 10.1007/978-3-030-93441-5doiSubjects--Topical Terms:

3594492
Solder and soldering
--Technological innovations.

LC Class. No.: TS610 / .R43 2022

Dewey Class. No.: 671.56

Recent progress in lead-free solder technology = materials development, processing and performances /
LDR:03400nmm a2200337 a 4500 001 2298220
003 DE-He213
005 20220301150527.0
006 m d
007 cr nn 008maaau
008 230324s2022 sz s 0 eng d
020 $a 9783030934415 $q (electronic bk.)
020 $a 9783030934408 $q (paper)
024 7 $a 10.1007/978-3-030-93441-5 $2 doi
035 $a 978-3-030-93441-5
040 $a GP $c GP
041 0 $a eng
050 4 $a TS610 $b .R43 2022
072 7 $a TGM $2 bicssc
072 7 $a TEC021000 $2 bisacsh
072 7 $a TGM $2 thema
082 0 4 $a 671.56 $2 23
090 $a TS610 $b .R295 2022
245 0 0 $a Recent progress in lead-free solder technology $h [electronic resource] : $b materials development, processing and performances / $c edited by Mohd Arif Anuar Mohd Salleh ... [et al.].
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2022.
300 $a xii, 328 p. : $b ill., digital ; $c 24 cm.
490 1 $a Topics in mining, metallurgy and materials engineering, $x 2364-3307
505 0 $a Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies.
520 $a This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB) Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD) This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
650 0 $a Solder and soldering $x Technological innovations. $3 3594492
650 0 $a Lead-free electronics manufacturing processes. $3 1005111
650 1 4 $a Metals and Alloys. $3 3591895
700 0 $a Mohd Arif Anuar Mohd Salleh. $3 3594491
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
830 0 $a Topics in mining, metallurgy and materials engineering. $3 2054736
856 4 0 $u https://doi.org/10.1007/978-3-030-93441-5
950 $a Chemistry and Materials Science (SpringerNature-11644)