東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Comparative CFD Analysis of the Effe...

Sutaria, Ankit.

Linked to FindBook

Google Book

Amazon

博客來

Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server./
Author:	Sutaria, Ankit.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2019,
Description:	56 p.
Notes:	Source: Masters Abstracts International, Volume: 81-09.
Contained By:	Masters Abstracts International81-09.
Subject:	Packaging. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=27629438
ISBN:	9781392354179

Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server.
Sutaria, Ankit.

Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server. - Ann Arbor : ProQuest Dissertations & Theses, 2019 - 56 p.

Source: Masters Abstracts International, Volume: 81-09.

Thesis (M.S.M.E.)--The University of Texas at Arlington, 2019.

This item must not be sold to any third party vendors.

Artificial intelligence (AI) has becoming an important area which may significantly impact everyone's daily life. This means a lot of high-performance chips such as high-performance CPU, GPU, FPGA (Field-programmable gate array), ASIC (application specific integrated circuit) devices may need. The thermal design power (TDP) of these chips are high, and now it is very common to see a processor TDP reaches as high as 300Watts[1]. When these high-power density processors are packaged together, the power density of the servers and compute boxes are significantly high. Traditional air-cooling is approaching its cooling capability limitation, especially when a cluster of racks is fully populated with computing-intensive nodes. The air cooling may still capable for high density thermal management, however there will be a significant amount of cost associate with it. Liquid cooling may provide a higher cooling efficiency, which can easily reject larger amount of heat generated from processors. This lowers the cooling PUE. In this work, the server used for study is FACEBOOK BIGBASIN which has 3OU chassis, consisting 8 Nvidia Volta V100 GPU, 4 PCIe cards, and 8 hot swappable fans. On the GPUs, there are 8 heatsinks on in the air-cooled model and 8 impingement type cold plates in the liquid cooled model. This work is proposed to identify, evaluate and develop effective liquid cooling by using cold plate which gives high performance compute with compared to air cooled solution. The GPU chips are assumed to be running at maximum Utilization. The cold plate is optimized for better thermal performance in 6sigma ET software.

ISBN: 9781392354179Subjects--Topical Terms:

585030
Packaging.

Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server.
LDR:02733nmm a2200337 4500 001 2264382
005 20200423113029.5
008 220629s2019 ||||||||||||||||| ||eng d
020 $a 9781392354179
035 $a (MiAaPQ)AAI27629438
035 $a (MiAaPQ)2502vireo1758Sutaria
035 $a AAI27629438
040 $a MiAaPQ $c MiAaPQ
100 1 $a Sutaria, Ankit. $3 3541500
245 1 0 $a Comparative CFD Analysis of the Effect of Air and Liquid Cooling on the Form Factor of GPU Server.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2019
300 $a 56 p.
500 $a Source: Masters Abstracts International, Volume: 81-09.
500 $a Advisor: Agonafer, Dereje;Nomura, Seiichi.
502 $a Thesis (M.S.M.E.)--The University of Texas at Arlington, 2019.
506 $a This item must not be sold to any third party vendors.
520 $a Artificial intelligence (AI) has becoming an important area which may significantly impact everyone's daily life. This means a lot of high-performance chips such as high-performance CPU, GPU, FPGA (Field-programmable gate array), ASIC (application specific integrated circuit) devices may need. The thermal design power (TDP) of these chips are high, and now it is very common to see a processor TDP reaches as high as 300Watts[1]. When these high-power density processors are packaged together, the power density of the servers and compute boxes are significantly high. Traditional air-cooling is approaching its cooling capability limitation, especially when a cluster of racks is fully populated with computing-intensive nodes. The air cooling may still capable for high density thermal management, however there will be a significant amount of cost associate with it. Liquid cooling may provide a higher cooling efficiency, which can easily reject larger amount of heat generated from processors. This lowers the cooling PUE. In this work, the server used for study is FACEBOOK BIGBASIN which has 3OU chassis, consisting 8 Nvidia Volta V100 GPU, 4 PCIe cards, and 8 hot swappable fans. On the GPUs, there are 8 heatsinks on in the air-cooled model and 8 impingement type cold plates in the liquid cooled model. This work is proposed to identify, evaluate and develop effective liquid cooling by using cold plate which gives high performance compute with compared to air cooled solution. The GPU chips are assumed to be running at maximum Utilization. The cold plate is optimized for better thermal performance in 6sigma ET software.
590 $a School code: 2502.
650 4 $a Packaging. $3 585030
650 4 $a Artificial intelligence. $3 516317
650 4 $a Electrical engineering. $3 649834
650 4 $a Mechanical engineering. $3 649730
690 $a 0548
690 $a 0549
690 $a 0544
690 $a 0800
710 2 $a The University of Texas at Arlington. $b Mechanical and Aerospace Engineering. $3 3286584
773 0 $t Masters Abstracts International $g 81-09.
790 $a 2502
791 $a M.S.M.E.
792 $a 2019
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=27629438