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Process variations in microsystems m...

Huff, Michael.

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Process variations in microsystems manufacturing

Record Type:	Electronic resources : Monograph/item
Title/Author:	Process variations in microsystems manufacturing/ by Michael Huff.
Author:	Huff, Michael.
Published:	Cham :Springer International Publishing : : 2020.,
Description:	xix, 521 p. :ill., digital ;24 cm.
[NT 15003449]:	Introduction -- Overview of Microsystems Manufacturing -- Process Variations in Microsystems Processing Steps -- Microsystems Metrology Methods and Associated Errors -- Process Integration and Variations in Material Properties -- Device Parameter Variations in Microsystems Manufacturing -- Quality Assurance and Control Methods Used in Microsystems Manufacturing -- Design Methods for Handling Process Variations -- Future Methods for Improved Microsystems Manufacturing Process Variations.
Contained By:	Springer eBooks
Subject:	Microelectromechanical systems. -
Online resource:	https://doi.org/10.1007/978-3-030-40560-1
ISBN:	9783030405601

Process variations in microsystems manufacturing
Huff, Michael.

Process variations in microsystems manufacturing[electronic resource] /by Michael Huff. - Cham :Springer International Publishing :2020. - xix, 521 p. :ill., digital ;24 cm. - Microsystems and nanosystems,2198-0063. - Microsystems and nanosystems..

Introduction -- Overview of Microsystems Manufacturing -- Process Variations in Microsystems Processing Steps -- Microsystems Metrology Methods and Associated Errors -- Process Integration and Variations in Material Properties -- Device Parameter Variations in Microsystems Manufacturing -- Quality Assurance and Control Methods Used in Microsystems Manufacturing -- Design Methods for Handling Process Variations -- Future Methods for Improved Microsystems Manufacturing Process Variations.

This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level. Examines and explains the basic processing steps used in MEMS fabrication; Illustrates best practices and lessons learned in manufacturing of microsystems for commercial products with detailed case studies; Reviews future methods that may provide for improved process variations.

ISBN: 9783030405601

Standard No.: 10.1007/978-3-030-40560-1doiSubjects--Topical Terms:

567138
Microelectromechanical systems.

LC Class. No.: TK7875 / .H844 2020

Dewey Class. No.: 621.381

Process variations in microsystems manufacturing
LDR:02589nmm a2200337 a 4500 001 2217806
003 DE-He213
005 20200814131923.0
006 m d
007 cr nn 008maaau
008 201120s2020 sz s 0 eng d
020 $a 9783030405601 $q (electronic bk.)
020 $a 9783030405588 $q (paper)
024 7 $a 10.1007/978-3-030-40560-1 $2 doi
035 $a 978-3-030-40560-1
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7875 $b .H844 2020
072 7 $a TDPB $2 bicssc
072 7 $a TEC027000 $2 bisacsh
072 7 $a TDP $2 thema
082 0 4 $a 621.381 $2 23
090 $a TK7875 $b .H889 2020
100 1 $a Huff, Michael. $3 3451324
245 1 0 $a Process variations in microsystems manufacturing $h [electronic resource] / $c by Michael Huff.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2020.
300 $a xix, 521 p. : $b ill., digital ; $c 24 cm.
490 1 $a Microsystems and nanosystems, $x 2198-0063
505 0 $a Introduction -- Overview of Microsystems Manufacturing -- Process Variations in Microsystems Processing Steps -- Microsystems Metrology Methods and Associated Errors -- Process Integration and Variations in Material Properties -- Device Parameter Variations in Microsystems Manufacturing -- Quality Assurance and Control Methods Used in Microsystems Manufacturing -- Design Methods for Handling Process Variations -- Future Methods for Improved Microsystems Manufacturing Process Variations.
520 $a This book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level. Examines and explains the basic processing steps used in MEMS fabrication; Illustrates best practices and lessons learned in manufacturing of microsystems for commercial products with detailed case studies; Reviews future methods that may provide for improved process variations.
650 0 $a Microelectromechanical systems. $3 567138
650 1 4 $a Nanotechnology and Microengineering. $3 1005737
650 2 4 $a Manufacturing, Machines, Tools, Processes. $3 3381528
650 2 4 $a Nanotechnology. $3 526235
650 2 4 $a Circuits and Systems. $3 896527
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a Microsystems and nanosystems. $3 2131069
856 4 0 $u https://doi.org/10.1007/978-3-030-40560-1
950 $a Engineering (Springer-11647)