Language:
English
繁體中文
Help
回圖書館首頁
手機版館藏查詢
Login
Back
Switch To:
Labeled
|
MARC Mode
|
ISBD
Reliability physics and engineering ...
~
McPherson, J. W.
Linked to FindBook
Google Book
Amazon
博客來
Reliability physics and engineering = time-to-failure modeling /
Record Type:
Electronic resources : Monograph/item
Title/Author:
Reliability physics and engineering/ by J. W. McPherson.
Reminder of title:
time-to-failure modeling /
Author:
McPherson, J. W.
Published:
Cham :Springer International Publishing : : 2019.,
Description:
xvii, 463 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:
Introduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals.
Contained By:
Springer eBooks
Subject:
Reliability (Engineering) -
Online resource:
https://doi.org/10.1007/978-3-319-93683-3
ISBN:
9783319936833
Reliability physics and engineering = time-to-failure modeling /
McPherson, J. W.
Reliability physics and engineering
time-to-failure modeling /[electronic resource] :by J. W. McPherson. - 3rd ed. - Cham :Springer International Publishing :2019. - xvii, 463 p. :ill. (some col.), digital ;24 cm.
Introduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals.
This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes-- all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases. Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications; Explains the fundamentals of reliability physics and engineering tools for building better products; Contains statistical training and tools within the text; Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
ISBN: 9783319936833
Standard No.: 10.1007/978-3-319-93683-3doiSubjects--Topical Terms:
647853
Reliability (Engineering)
LC Class. No.: TA169
Dewey Class. No.: 620.00452
Reliability physics and engineering = time-to-failure modeling /
LDR
:03177nmm a2200337 a 4500
001
2178717
003
DE-He213
005
20190702170331.0
006
m d
007
cr nn 008maaau
008
191122s2019 gw s 0 eng d
020
$a
9783319936833
$q
(electronic bk.)
020
$a
9783319936826
$q
(paper)
024
7
$a
10.1007/978-3-319-93683-3
$2
doi
035
$a
978-3-319-93683-3
040
$a
GP
$c
GP
041
0
$a
eng
050
4
$a
TA169
072
7
$a
TJFC
$2
bicssc
072
7
$a
TEC008010
$2
bisacsh
072
7
$a
TJFC
$2
thema
082
0 4
$a
620.00452
$2
23
090
$a
TA169
$b
.M172 2019
100
1
$a
McPherson, J. W.
$3
3110521
245
1 0
$a
Reliability physics and engineering
$h
[electronic resource] :
$b
time-to-failure modeling /
$c
by J. W. McPherson.
250
$a
3rd ed.
260
$a
Cham :
$b
Springer International Publishing :
$b
Imprint: Springer,
$c
2019.
300
$a
xvii, 463 p. :
$b
ill. (some col.), digital ;
$c
24 cm.
505
0
$a
Introduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals.
520
$a
This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes-- all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases. Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications; Explains the fundamentals of reliability physics and engineering tools for building better products; Contains statistical training and tools within the text; Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
650
0
$a
Reliability (Engineering)
$3
647853
650
1 4
$a
Circuits and Systems.
$3
896527
650
2 4
$a
Electronic Circuits and Devices.
$3
1245773
650
2 4
$a
Quality Control, Reliability, Safety and Risk.
$3
891027
710
2
$a
SpringerLink (Online service)
$3
836513
773
0
$t
Springer eBooks
856
4 0
$u
https://doi.org/10.1007/978-3-319-93683-3
950
$a
Engineering (Springer-11647)
based on 0 review(s)
Location:
ALL
電子資源
Year:
Volume Number:
Items
1 records • Pages 1 •
1
Inventory Number
Location Name
Item Class
Material type
Call number
Usage Class
Loan Status
No. of reservations
Opac note
Attachments
W9368574
電子資源
11.線上閱覽_V
電子書
EB TA169
一般使用(Normal)
On shelf
0
1 records • Pages 1 •
1
Multimedia
Reviews
Add a review
and share your thoughts with other readers
Export
pickup library
Processing
...
Change password
Login