東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Assembly process development, reliab...

Lin, Ta-Hsuan.

Linked to FindBook

Google Book

Amazon

博客來

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology./
Author:	Lin, Ta-Hsuan.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2008,
Description:	212 p.
Notes:	Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.
Contained By:	Dissertation Abstracts International69-07B.
Subject:	Mechanical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3324387
ISBN:	9780549762669

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
Lin, Ta-Hsuan.

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology. - Ann Arbor : ProQuest Dissertations & Theses, 2008 - 212 p.

Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.

Thesis (Ph.D.)--State University of New York at Binghamton, 2008.

Flexible Flip Chip Connection (F2C2) technology was proposed utilizing copper columns instead of solder balls as the electrical and mechanical interconnection between the semiconductor chip and the substrate. The most significant benefit of F2C2 technology is the increased standoff height and flexible copper columns that accommodate the CTE mismatch between chip and substrate. Hence, the strain within the joints is reduced and the need for underfill for fatigue life enhancement is eliminated.

ISBN: 9780549762669Subjects--Topical Terms:

649730
Mechanical engineering.

Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
LDR:03377nmm a2200349 4500 001 2161447
005 20180907134544.5
008 190424s2008 ||||||||||||||||| ||eng d
020 $a 9780549762669
035 $a (MiAaPQ)AAI3324387
035 $a (MiAaPQ)binghamton:1917
035 $a AAI3324387
040 $a MiAaPQ $c MiAaPQ
100 1 $a Lin, Ta-Hsuan. $3 3349408
245 1 0 $a Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2008
300 $a 212 p.
500 $a Source: Dissertation Abstracts International, Volume: 69-07, Section: B, page: 4382.
500 $a Adviser: Susan Lu.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 2008.
520 $a Flexible Flip Chip Connection (F2C2) technology was proposed utilizing copper columns instead of solder balls as the electrical and mechanical interconnection between the semiconductor chip and the substrate. The most significant benefit of F2C2 technology is the increased standoff height and flexible copper columns that accommodate the CTE mismatch between chip and substrate. Hence, the strain within the joints is reduced and the need for underfill for fatigue life enhancement is eliminated.
520 $a The primary objective of this research effort was to develop a process for attaching a silicon chip to a substrate using a matrix of flexible copper wires. The F2C2 process utilizes copper wires embedded in a wafer slice to interconnect the footprints of the chip and substrate. The wafer slice is composed of a heat resistant, dissolvable substance that encapsulates and maintains the wires in position. After chip-wafer-substrate attachment, the slice is dissolved away with water/solvent, leaving the flexible wires connecting the chip and substrate.
520 $a The secondary objective was to conduct initial reliability test and failure mechanism analysis. Accelerated Thermal Cycling (ATC) tests were conducted on F2C2 components as well as C4 and underfilled C4 components. The ATC test was conducted in an air-to-air thermal shock chamber. JEDEC standard, JESD22-A104C condition B, was applied with test condition --55 °C to 125 °C, 2 cycles per hour, with a failure criterion of 100 mO electrical pair resistance increase from time zero. The ATC test results were analyzed in regard to failure locations, failure mode, and characteristic life.
520 $a Another objective of this research is to use Finite Element Modeling (FEM) to study thermomechanical behavior and predict fatigue life. Nondestructive measurements were made using Digital Image Correlation to determine the warpage of the chip and the substrate for F2C2, C4 and underfilled C4 to compare their thermomechanical behaviors and for FEM model validation. FEM models were used to study the stress/strain distribution in the chip, substrate and interconnects. The FEM models were also used to predict the fatigue life and combined with Design of Experiments (DOE) method to study the effects of structural parameters with respect of fatigue life.
590 $a School code: 0792.
650 4 $a Mechanical engineering. $3 649730
650 4 $a Industrial engineering. $3 526216
650 4 $a Systems science. $3 3168411
690 $a 0548
690 $a 0546
690 $a 0790
710 2 $a State University of New York at Binghamton. $b Systems Science. $3 1023839
773 0 $t Dissertation Abstracts International $g 69-07B.
790 $a 0792
791 $a Ph.D.
792 $a 2008
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3324387