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Proceedings of international confere...

International conference on planarization / CMP technology ((2008 :)

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Proceedings of international conference on planarization/CMP technology 2008 : = theme: Frontier of advanced CMP technology /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Proceedings of international conference on planarization/CMP technology 2008 :/ editor chao-Chang A. Chen, Li-Sheng Hsu.
Reminder of title:	theme: Frontier of advanced CMP technology /
remainder title:	ICPT 2008.
other author:	Chen, Chao-Chang A.
Corporate Body:	International conference on planarization / CMP technology
Published:	Hsinchu, Taiwan :Taiwan Society for Abrasive Technology, : c2008.,
Description:	525, vi p. :ill. ;27 cm.
Subject:	Metals - Pickling -
ISBN:	9789868481909

Proceedings of international conference on planarization/CMP technology 2008 : = theme: Frontier of advanced CMP technology /
International conference on planarization / CMP technologyHsinchu, Taiwan)(2008 :

Proceedings of international conference on planarization/CMP technology 2008 :theme: Frontier of advanced CMP technology /ICPT 2008.editor chao-Chang A. Chen, Li-Sheng Hsu. - Hsinchu, Taiwan :Taiwan Society for Abrasive Technology,c2008. - 525, vi p. :ill. ;27 cm.

Includes bibliographical references.

ISBN: 9789868481909Subjects--Topical Terms:

3328473
Metals
--PicklingSubjects--Index Terms:

Poly-Si and duelectric CMP.

LC Class. No.: TK7871 / .I61 2008

Proceedings of international conference on planarization/CMP technology 2008 : = theme: Frontier of advanced CMP technology /
LDR:00789cam 2200205 a 4500 001 2144861
003 ChTaNC
005 20110322104034.0
008 190130s2008 ch a b 101 u eng d
020 $a 9789868481909 $q (hbk.)
020 $a 9868481902 $q (hbk.)
040 $a CYT $b eng
050 # 4 $a TK7871 $b .I61 2008
110 2 $a International conference on planarization / CMP technology $d (2008 : $c Hsinchu, Taiwan) $3 3328474
245 1 0 $a Proceedings of international conference on planarization/CMP technology 2008 : $b theme: Frontier of advanced CMP technology / $c editor chao-Chang A. Chen, Li-Sheng Hsu.
246 3 1 $a ICPT 2008.
246 3 1 $a Frontier of advanced CMP technology.
246 3 1 $a Frontier of advanced Chemical Mechanical Planarization technology.
260 # $a Hsinchu, Taiwan : $b Taiwan Society for Abrasive Technology, $c c2008.
300 $a 525, vi p. : $b ill. ; $c 27 cm.
504 $a Includes bibliographical references.
650 # 0 $a Metals $x Pickling $x Congresses. $3 3328473
650 # 0 $a Semiconductors $x Surfaces $x Congresses. $3 703343
650 # 0 $a Chemical mechanical planarization $x Congresses. $3 3328472
650 # 0 $a Microelectronics $x Materials $x Congresses. $3 669447
650 # 0 $a Grinding and polishing $x Congresses. $3 718720
653 0 # $a Poly-Si and duelectric CMP.
700 1 $a Chen, Chao-Chang A. $3 3328475
700 1 $a Hsu, Li-Sheng. $3 3328476