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The 3rd IMPACT, the 10th EMAP joint ...

International microsystems, packings, assembly and circuits technology conference ((2008 :)

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The 3rd IMPACT, the 10th EMAP joint conference proceedings : = (EMAP2008) : Oct. 22-24, 2008, Taipei /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	The 3rd IMPACT, the 10th EMAP joint conference proceedings :/ organized by IMPACT, EMAP & IEEE.
Reminder of title:	(EMAP2008) : Oct. 22-24, 2008, Taipei /
remainder title:	EMAP2008.
Corporate Body:	International microsystems, packings, assembly and circuits technology conference
Published:	Taipei :IEEE, : c2008.,
Description:	1張光碟片 :有聲, 彩色 ;4 3/4吋.
Notes:	Includes advertising material.
Subject:	Electronic packaging - Congresses. -

The 3rd IMPACT, the 10th EMAP joint conference proceedings : = (EMAP2008) : Oct. 22-24, 2008, Taipei /
International microsystems, packings, assembly and circuits technology conferenceTaipei, Taiwan)(2008 :

The 3rd IMPACT, the 10th EMAP joint conference proceedings :(EMAP2008) : Oct. 22-24, 2008, Taipei /[電子資源] / EMAP2008.organized by IMPACT, EMAP & IEEE. - Taipei :IEEE,c2008. - 1張光碟片 :有聲, 彩色 ;4 3/4吋.

Includes advertising material.

Includes bibliographical references.

Mode of access: World Wide Web.

Subjects--Topical Terms:

649467
Electronic packaging
--Congresses.Index Terms--Genre/Form:

959526
Electronic books

The 3rd IMPACT, the 10th EMAP joint conference proceedings : = (EMAP2008) : Oct. 22-24, 2008, Taipei /
LDR:00933cam 2200229Ia 4500 001 2130128
003 OCoLC
005 20070213195824.0
007 co cga
008 181001s2008 njua sb 100 0 eng d
020 $q (CD-ROM)
040 $a NDHU $b eng
090 $a TK7870 $b .I66 2008
110 2 $a International microsystems, packings, assembly and circuits technology conference $d (2008 : $c Taipei, Taiwan) $3 3294436
245 1 0 $a The 3rd IMPACT, the 10th EMAP joint conference proceedings : $h [電子資源] / $b (EMAP2008) : Oct. 22-24, 2008, Taipei / $c organized by IMPACT, EMAP & IEEE.
246 3 0 $a EMAP2008.
246 3 1 $a Electronic materials and packaging.
246 1 # $i Electronic reproduction has title: $a Electronic Materials and Packaging, 2008, (EMAP 2008), International conference.
260 # $a Taipei : $b IEEE, $c c2008.
300 $a 1張光碟片 : $b 有聲, 彩色 ; $c 4 3/4吋.
500 $a Includes advertising material.
504 $a Includes bibliographical references.
538 $a Mode of access: World Wide Web.
538 $a system requirement: Internet access ; World Wide Web browser.
650 # 0 $a Electronic packaging $x Congresses. $3 649467
650 # 6 $a Électronique $x Matériaux $v Congrès. $3 3294432
650 # 6 $a Mise sous boîtier (Électronique) $v Congrès. $3 3294433
655 # 7 $a Electronic books $3 959526