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Bi-Ag高溫無鉛銲料與基材介面反應研究 = = Interfacia...

莊鑫毅

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Bi-Ag高溫無鉛銲料與基材介面反應研究 = = Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Bi-Ag高溫無鉛銲料與基材介面反應研究 = /
Reminder of title:	Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates
remainder title:	Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates
Author:	莊鑫毅
Published:	[花蓮縣] : 國立東華大學材料科學與工程學系, : 民96[2007],
Description:	14,103面 : 圖,表 ; 30公分
Notes:	指導教授︰宋振銘
Subject:	B-Ag合金 -
Online resource:	http://etd.lib.ndhu.edu.tw/ETD-db/ETD-search-c/view_etd?URN=etd-0629107-175917PDF全文

Bi-Ag高溫無鉛銲料與基材介面反應研究 = = Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates
莊鑫毅

Bi-Ag高溫無鉛銲料與基材介面反應研究 = Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic SubstratesInterfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates - [花蓮縣] : 國立東華大學材料科學與工程學系, 民96[2007] - 14,103面 : 圖,表 ; 30公分

指導教授︰宋振銘

碩士論文--國立東華大學材料科學與工程學系,2007

參考書目︰面102-103Subjects--Topical Terms:

2613174
B-Ag合金

Bi-Ag高溫無鉛銲料與基材介面反應研究 = = Interfacial Behaviour between Bi-Ag High Temperature Solders and Metallic Substrates
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