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More-than-Moore 2.5D and 3D SiP inte...

Radojcic, Riko.

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More-than-Moore 2.5D and 3D SiP integration

Record Type:	Electronic resources : Monograph/item
Title/Author:	More-than-Moore 2.5D and 3D SiP integration/ by Riko Radojcic.
Author:	Radojcic, Riko.
Published:	Cham :Springer International Publishing : : 2017.,
Description:	xv, 182 p. :ill., digital ;24 cm.
[NT 15003449]:	Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.
Contained By:	Springer eBooks
Subject:	Embedded computer systems. -
Online resource:	http://dx.doi.org/10.1007/978-3-319-52548-8
ISBN:	9783319525488

More-than-Moore 2.5D and 3D SiP integration
Radojcic, Riko.

More-than-Moore 2.5D and 3D SiP integration[electronic resource] /by Riko Radojcic. - Cham :Springer International Publishing :2017. - xv, 182 p. :ill., digital ;24 cm.

Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

ISBN: 9783319525488

Standard No.: 10.1007/978-3-319-52548-8doiSubjects--Topical Terms:

582088
Embedded computer systems.

LC Class. No.: TK7895.E42

Dewey Class. No.: 006.22

More-than-Moore 2.5D and 3D SiP integration
LDR:01917nmm a2200313 a 4500 001 2090324
003 DE-He213
005 20170823133609.0
006 m d
007 cr nn 008maaau
008 171013s2017 gw s 0 eng d
020 $a 9783319525488 $q (electronic bk.)
020 $a 9783319525471 $q (paper)
024 7 $a 10.1007/978-3-319-52548-8 $2 doi
035 $a 978-3-319-52548-8
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7895.E42
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 006.22 $2 23
090 $a TK7895.E42 $b R131 2017
100 1 $a Radojcic, Riko. $3 1531764
245 1 0 $a More-than-Moore 2.5D and 3D SiP integration $h [electronic resource] / $c by Riko Radojcic.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2017.
300 $a xv, 182 p. : $b ill., digital ; $c 24 cm.
505 0 $a Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.
520 $a This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
650 0 $a Embedded computer systems. $3 582088
650 0 $a Systems integration. $3 2143195
650 1 4 $a Engineering. $3 586835
650 2 4 $a Circuits and Systems. $3 896527
650 2 4 $a Electronic Circuits and Devices. $3 1245773
650 2 4 $a Processor Architectures. $3 892680
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-52548-8
950 $a Engineering (Springer-11647)