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Eutectic diffusion brazing process f...

Wilson, Paul.

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Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features./
Author:	Wilson, Paul.
Description:	93 p.
Notes:	Source: Dissertation Abstracts International, Volume: 75-05(E), Section: B.
Contained By:	Dissertation Abstracts International75-05B(E).
Subject:	Engineering, Industrial. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3611061
ISBN:	9781303714252

Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features.
Wilson, Paul.

Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features. - 93 p.

Source: Dissertation Abstracts International, Volume: 75-05(E), Section: B.

Thesis (Ph.D.)--The University of Texas at Arlington, 2013.

Eutectic brazing occurs when two metals, such as aluminum and copper, react and diffuse together at a temperature lower than either material would melt separately. Commonly used in electronics manufacturing, this brazing method provides the basis for a new process of joining a laminated device with micro fluidic features. The proposed process overcomes the challenges of aluminum oxidation resulting from traditional diffusion bonding of aluminum laminae and does not require flux or caustic material pre-treatments. The process also protects surface geometries and avoids warpage, which is common with other higher-temperature joining processes such as welding.

ISBN: 9781303714252Subjects--Topical Terms:

626639
Engineering, Industrial.

Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features.
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020 $a 9781303714252
035 $a (MiAaPQ)AAI3611061
035 $a AAI3611061
040 $a MiAaPQ $c MiAaPQ
100 1 $a Wilson, Paul. $3 2102458
245 1 0 $a Eutectic diffusion brazing process for joining aluminum laminae with macro- and microscale features.
300 $a 93 p.
500 $a Source: Dissertation Abstracts International, Volume: 75-05(E), Section: B.
500 $a Adviser: John W. Priest.
502 $a Thesis (Ph.D.)--The University of Texas at Arlington, 2013.
520 $a Eutectic brazing occurs when two metals, such as aluminum and copper, react and diffuse together at a temperature lower than either material would melt separately. Commonly used in electronics manufacturing, this brazing method provides the basis for a new process of joining a laminated device with micro fluidic features. The proposed process overcomes the challenges of aluminum oxidation resulting from traditional diffusion bonding of aluminum laminae and does not require flux or caustic material pre-treatments. The process also protects surface geometries and avoids warpage, which is common with other higher-temperature joining processes such as welding.
520 $a This research provides a foundation for manufacturing multi-laminae, microfluidic, micro-feature devices in metals, especially aluminum. A reliable method of joining metal laminae could help make the manufacturing of these types of devices cost effective and reliable. These advantages will lead to faster rates of adoption of microfluidic micro-devices in industries such as pharmaceuticals, energy, food, and others.
520 $a This work combined laminae of aluminum alloy 6061 with copper foil interlayers to produce a milli-channel heat exchanger and reactor device. The devices contained overlapping coolant and reactant channel systems arranged perpendicularly within each lamina. Related work suggests that diffused joints are mechanically robust in contrast to the parent materials.
520 $a A laser micromachining center was used to trim the copper foil interlayers and a vacuum furnace hot press served to join laminae for the device. A reliable, leak-tight joining of the laminae occurred. Closed-loop argon testing at high operating temperatures verified the seal of the joint. The process repeatedly produced leak-tight, milli-channel heat-exchange and reactor devices.
520 $a The joining process is advantageous for joining complex milli- and micro-scale fluidic devices, such as a heat exchange and reactor device. Reliable joining takes place without application of fluxes, metal deposition, hazardous chemicals, or expensive cleanroom support.
520 $a This process will also benefit future microfluidics-related research and the integration of such technologies as arrayed milli-channel heat exchangers and reactor devices in industry. These devices enable modular scaling of production capacity, on-demand chemical processing, and higher purity products.
590 $a School code: 2502.
650 4 $a Engineering, Industrial. $3 626639
690 $a 0546
710 2 $a The University of Texas at Arlington. $b Industrial and Manufacturing Engineering. $3 2094673
773 0 $t Dissertation Abstracts International $g 75-05B(E).
790 $a 2502
791 $a Ph.D.
792 $a 2013
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3611061